Industry Directory: innova packaging systems (184)

Surface Mount Technology Association (SMTA)

Surface Mount Technology Association (SMTA)

Industry Directory | Association / Non-Profit / Events Organizer / Training Provider

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

ASYMTEK Products | Nordson Electronics Solutions

ASYMTEK Products | Nordson Electronics Solutions

Industry Directory | Manufacturer

A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.

New SMT Equipment: innova packaging systems (495)

Peel Back Force Tester (PBFT)

Peel Back Force Tester (PBFT)

New Equipment | Pick & Place

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Precision Lead Former for Axial Components (CF-8)

Precision Lead Former for Axial Components (CF-8)

New Equipment | Lead Forming

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

Electronics Forum: innova packaging systems (324)

Raw PCB packaging

Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef

Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E

AOI systems

Electronics Forum | Thu Apr 05 08:02:33 EDT 2001 | brownsj

I used to work for a company called Intelligent Reasoning Systems Incorporated. http://www.irsinc.com based in Austin Texas. They manufactured two different AOI systems depending on the component packages you wanted to inspect. The good thing about t

Used SMT Equipment: innova packaging systems (265)

Panasonic high speed chip mounter NPM

Panasonic high speed chip mounter NPM

Used SMT Equipment | SMT Equipment

Product Name:Panasoinc  high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Panasonic original high speed chip mounter NPM

Panasonic original high speed chip mounter NPM

Used SMT Equipment | SMT Equipment

Product Name:Panasoinc  high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: innova packaging systems (3156)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

See GPD Global's PCD Technology at IMAPS Device Packaging 2011

Industry News | 2011-02-17 15:04:54.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.

GPD Global

Parts & Supplies: innova packaging systems (71)

Siemens Cylinder 03038587-01

Siemens Cylinder 03038587-01

Parts & Supplies | SMT Equipment

00374610-01 Bearing flange drive wheel 00374611-01 Drive wheel belt 00374653-01 DRIVER COMPLETE 00374681-01 SIPLACE C Pro 1.4 Basic Package; includes following Software: Programmingsoftware, Operatormonitoring and one MSDE data base; for max. 5 SI

Qinyi Electronics Co.,Ltd

Siemens DEFLECTION UNIT X 00330938-02

Siemens DEFLECTION UNIT X 00330938-02

Parts & Supplies | SMT Equipment

00375200-01 Retrof.kit Discharge Choke Coil, HS50-60 00375245-01 SPARE PART KIT X-DRIVE FOR HF UNTIL S-NR. 00375273-01 Cable abrasion protection foil 00375274-01 Cable abrasion protection foil 00375276-01 Cable abrasion protection foil 300mm 003

Qinyi Electronics Co.,Ltd

Technical Library: innova packaging systems (42)

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Technical Library | 2021-06-15 15:17:33.0

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.

ASYMTEK Products | Nordson Electronics Solutions

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Technical Library | 2020-02-26 23:24:02.0

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.

ASYMTEK Products | Nordson Electronics Solutions

Videos: innova packaging systems (627)

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

Videos

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

Peel Back Tester

Peel Back Tester

Videos

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Training Courses: innova packaging systems (9)

Counterfeit Component Prevention Training Course

Training Courses | | | Other Courses

Other courses related to electronics manufacturing and assembly

Blackfox Training Institute, LLC

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: innova packaging systems (29)

Wafer-Level Packaging Symposium

Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA

Wafer-Level Packaging Symposium

Surface Mount Technology Association (SMTA)

Wafer-Level Packaging Symposium

Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA

Wafer-Level Packaging Symposium

Surface Mount Technology Association (SMTA)

Career Center - Jobs: innova packaging systems (91)

SMT Manufacturing Engineer - 2nd Shift

Career Center | Houston, Texas USA | Engineering,Management,Production

SMT Manufacturing Engineer – 2nd Shift Hunting Innova is a Houston based company serving industrial, energy, medical, defense and aerospace segments of the Electronic Manufacturing Services (EMS) Industry since 1989.  Hunting Innova is located in N

Hunting Innova

Mechanical Design Engineer

Career Center | Dallas, Texas USA | Engineering

Skills/Requirements: Experience in solid Edge CAD/CAM 3D system software and electronic packaging, Prior experience designing packaging systems a plus. Duties/Functions: Responsibility for the design of mechanical systems for electronic packaging. W

EMSR, Inc.

Career Center - Resumes: innova packaging systems (53)

Sales Agent/Data Analyst

Career Center | Quito, Ecuador | Sales/Marketing,Technical Support

Technical Sales (machinery, animal and plant protection products). Sales Forecast New Products (Bsss Diffusion Model).

Asst.Manager Manufacturing &QC

Career Center | Bangalore, India | Engineering,Management,Production,Quality Control,Technical Support

WORK EXPERIENCE DETAILS: 7+ Years of Experience in manufacturing & hardware testing of Protocol conveter & Commissioning, Products delivery and QA/QC. 2+ Years of Experience in Hardware testing and Package Level testing. 2+ Years of Experience in

Express Newsletter: innova packaging systems (1018)

Assembly and Rework of Lead Free Package on Package Technology

Assembly and Rework of Lead Free Package on Package Technology SMTnet Express March 15, 2012, Subscribers: 25003, Members: Companies: 8826, Users: 32832 Assembly and Rework of Lead Free Package on Package Technology by: Raymond G. Clark, Joseph D

Partner Websites: innova packaging systems (19959)

Power Electronics -Power Device Packaging

Heller Industries Inc. | https://hellerindustries.com/power-electronics/

Power Electronics -Power Device Packaging Home » Power Device Packaging Power Electronics:  Device Packaging The Need for Void-Free Power Electronics Device Packaging The trend today in power electronics is to move towards smaller form factors while maintaining or increasing overall power requirements

Heller Industries Inc.

Size Does Matter – Breaking the Barriers of Wafer Level Packaging-SMT Technical-Reflow oven,SMT Refl

| http://etasmt.com/cc?ID=te_news_industry,26566&url=_print

Size Does Matter – Breaking the Barriers of Wafer Level Packaging-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News


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Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

High Precision Fluid Dispensers
Void Free Reflow Soldering

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Sell Your Used SMT & Test Equipment

World's Best Reflow Oven Customizable for Unique Applications
Circuit Board, PCB Assembly & electronics manufacturing service provider

Wave Soldering 101 Training Course
Electronic Solutions R3

Thermal Transfer Materials.