Industry Directory | Consultant / Service Provider / Media / Publisher / Online Resource / Other
PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
Industry Directory | Consultant / Service Provider / Manufacturer
U.S. based contract manufacturer providing turn-key EMS solutions to defense and commercial OEM's.
New Equipment | Board Handling - Conveyors
Model No: KSUN 350A Destacker / Push-up Stacker MAX PCB`s capacity: 300pcs (0.6mm thickness PCB) cycling time: Approx 8 seconds Power supply: 100-230V AC (customized), single phase Power load: MAX 150 VA Air pressure: 4-6 bar Air volume: MAX
New Equipment | Board Handling - Conveyors
product instruction ※ Stable and reliable integrated control system ※ Easy to operate touch LED buttons or touch screen control interface ※Machine always fault monitoring ※ optional pass working mode ※ Smooth and parallel width adjustment (
Electronics Forum | Tue Dec 30 02:45:36 EST 1997 | Karthik
Hi there, I am looking for dimensions of a surface mount component of 1806 case size (the component is an RF choke). I cannot find it in the PROTEL standard library, or even on the web. Please e-mail me directly or post it on the forum, if you have t
Electronics Forum | Thu Feb 17 18:15:57 EST 2011 | rodrigo
Hi All, Does the Inspector software have a library manager? I see a "Standard" and an "Alternate" library folders. The standard library shows the outline (like a footprint) for the components but the alternate library has pictures and outlines with
Used SMT Equipment | AOI / Automated Optical Inspection
- 8 CAMERAS(5 MEGA PIXEL CAMERA) • High performance inspection for 01005 components • New 5.0 megapixel CMOS color cameras • 17 micron camera resolution • Dual-core dual-processor computer • Line-speed inspection for demanding cell phone and
Used SMT Equipment | Pick and Place/Feeders
Panasonic high-speed mounter NPM-D3 achieves high productivity per unit area in the integrated assembly line mounter & inspection a coherent system to achieve high efficiency and high quality production. Customers are free to choose the actual assemb
Industry News | 2017-08-19 13:31:56.0
GPD Global will demonstrate its Hyperion dispense system in booths 1C03 & 1C10 at upcoming NEPCON South China 2017. This fully automated dispense platform incorporates the latest technology from GPD Global in a compact footprint. Equipped with linear motor drives, smart pump technology, full touch screen interface, vision centric system operation & more, this is a dispense system not to be missed.
Industry News | 2017-01-26 19:53:00.0
GPD Global will exhibit in Booth 2933 at the upcoming IPC APEX EXPO 2017 scheduled to take place February14-16, San Diego Convention Center. GPD Global will officially launch its new, fully automated dispense platform, Hyperion, and a new, low cost conformal coating system.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
In-line or stand-alone fluxer/pre-heater This compact modular in-line system utilises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single sold
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
Career Center | San Jose, CA, California USA | Engineering,Production,Research and Development
Senior PCB Designer: Want to be part of an exciting pre-IPO enterprise B2B company working on the cutting edge of internet-of-things, artificial intelligence & agents, blockchain, and manufacturing technology? This well-funded venture-backed co
Career Center | Addison,Texas, Texas USA | Engineering
Strong background in design, development, debugging, integration and management of automated test equipment primarily Genrad 228x and 227x,and Teradyne 18xx and HP3070. Implemented networking system between tester and programming stations. created a
Career Center | Vestal, New York USA | Engineering,Research and Development
Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using
Career Center | , Texas | Human Resources,Maintenance,Management,Technical Support
Over 17 years in the training and development industry.� I have a track record of successes in designing strategic programs that address organizational skill gaps and business initiatives. Being an expert in Instructional Systems Design (ISD) I have
SMTnet Express, May 5, 2022, Subscribers: 25,613, Companies: 11,567, Users: 27,202 Electronics Manufacturing Technical Articles Rapid Deployment of Automated Test-System for High-Volume Automotive USB-C Hub Adoption and integration
PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/UserGuide/download/Library%20Expert%20Through-hole%20Families.pdf
PCBL - Footprint Expert [404] LOGIN Downloads About Footprint Expert Parts Forum Distributors Sales & Support About Us News History Altium Designer CircuitStudio P-CAD Allegro OrCAD Layout OrCAD PCB Board Station PADS Standard PADS Professional Xpedition VX CADSTAR CR-5000 / 8000 eCADSTAR 3D STEP
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FPC-with-Time-Pressure-Control-in-FLOware-Software-22240106.pdf
FPC with Time Pressure Control Integrated into FLOware Software FPC with Time Pressure Control - Integrated Addendum to: FLOware® Software User Guide PN 22100080D Part No
