Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Sat Oct 15 01:47:09 EDT 2022 | auriga2001
I might need some help to explain what I'm seeing here. The first 3 look like before pictures. They seem ok. The last 3 look like after pictures. It doesn't look like fracturing joints as would be a normal failure for vibration test, more like it rea
Industry News | 2013-09-12 14:29:04.0
STI Electronics, Inc. announces that it will exhibit in Booth #301 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2018-03-11 11:38:15.0
Flextron Circuit Assembly has added 3D Solder Paste Inspection (SPI) capability and Automated Optical Inspection (AOI) to its PCBA manufacturing lines, ensuring high quality and reliability in its finished electronic assemblies.
We can provide professional SMT one line sulotion include SMT loader, Solder paste printer , reflow oven, AOI and so on. E-mail: tina@gdmoje.com Web: www.moje.en.alibaba.com
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
SMTnet Express, October 24, 2019, Subscribers: 32,268, Companies: 10,908, Users: 25,250 Investigation of PCB Failure after SMT Manufacturing Process Credits: ACI Technologies, Inc. An ACI Technologies customer inquired regarding PCB failures
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
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