Industry Directory | Training Provider / Events Organizer / Association / Non-Profit
IPC is the trade association for the printed wiring board and electronics assembly industries.
Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high
Industry News | 2009-06-16 12:26:28.0
New Five-Day Class Teaches Practical as well as Lecture
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-10 20:03:37.0
Since the IPC-4552 rev A for ENIG was introduced there have been many requests for clarification of acceptable and unacceptable levels of nickel corrosion. This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed. The study will attempt to produce level 1, level 2, and level 3 corrosion as denoted by IPC-4552 rev A and tabulate wetting balance results and congruity of intermetallic formed.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.
The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Events Calendar | Tue Sep 10 00:00:00 EDT 2019 - Tue Sep 10 00:00:00 EDT 2019 | Huntsville, Alabama USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Springfield, Virginia USA | Production
We need someone who is excellent at hand solder of through hole and SMT componets to pcb. Must be capable and content performing the task. IPC certification helpful but will accept experienced person that can perform the task to IPC standards.
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement
SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 Now Available: Amendments for J-STD-001F and IPC-A-610F In order to keep up with industry demand, IPC has released
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
. IPC-J-STD-001 uses 3 classes to define solder joint goal acceptability for various electronic products. CLASS 1 – General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. Toys CLASS 2
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/ipc-specialist/ipc-a-600-cis/
:00 IPC-A-600 Certified IPC Specialist (CIS) OPERATOR ACCEPTABILITY OF PRINTED BOARDS EXTERNAL & INTERNAL BARE BOARD This course is designed to certify Operators/Inspectors in identifying characteristics that may occur either internally of externally in the printed circuit board
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
