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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
Layer Count: 2L Board Thickness: 0.8mm Dimension: 140*85mm Material: Rogers RO5880 Surface Copper: 35μm Min Hole Diameter: 2.0mm Min line Width/Space: N/A Surface Finish: ENIG Do you need a PCB for special signal requirement into your products? High
Electronics Forum | Fri Oct 20 14:13:32 EDT 2000 | DENNIS XIONG
Dear all, We have a PCB design mistake that causes exposed copper layers on the edges of breakaway locations. Although we fixed the design, but we already made a lot of boards plus many made before we found the problem. I wonder if any one have some
Electronics Forum | Tue Mar 14 21:22:41 EST 2000 | Dave F
Bingo!!! By panelizing and adding breakaway rails (as Nancy says), Stuart can pour copper up to his board fab's tolerance from the board edge. Traditionally, he just wants to make sure no copper shows on the edge of the board. Then again, it's his
Industry News | 2003-03-14 09:03:48.0
Sarantel has developed a surface-mount version of its active GeoHelix miniature GPS antenna.
Industry News | 2009-06-16 12:26:28.0
New Five-Day Class Teaches Practical as well as Lecture
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
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The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
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Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
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% climb 18 IPC-A-610, New Item – Board inserted into slots 19 IPC-A-610, 6.1.1.1 20 IPC-A-610, 6.1.1.1 21 610 - 6.1.1.1 Criteria Modified to accept the proposal Target - 1, 2, 3 Terminal base circumference is in full contact with the land, with no evidence of mechanical distortion of land
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Support Suppliers Resources Careers Home Our Company Events IPC APEX 2018 IPC APEX 2018 San Diego, California, USA 2018-02-27 - 2018-03-01 Precisely where you want to be – Come see
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