Industry Directory | Manufacturer
Hi-Rel Thick Film Substrates, Multilayer, Thru-Hole/Edge Around, 2mil Lines Etched Conductors
Industry Directory | Manufacturer
Services, components and consumables for electronic manufacturing
FKN Systek K7000 - Compact PCB Singulator for Close Component Spacing K7000 Singulates panels with components up to .030" apart. Blades Made of Long Lasting High Speed Steel. Linear Blade 12" (305mm) long. Front and Back adjustable work table.
The FKN Systek K4000 motorized linear blade depanelizer is designed for high volume singulation of scored and skip scored Printed Circuit Boards. No programming necessary. (Switch select operating mode and speed) Singulate panels with components
Electronics Forum | Thu Mar 20 16:53:32 EDT 2008 | guhansub
Min spacing will be 0.75'' on all the 4 edges
Electronics Forum | Wed Mar 19 09:54:44 EDT 2008 | davef
Here's what we suggest: * Keep a 5-mm space between a board edge and a ceramic capacitor. * Mount the capacitor parallel relative to the edge. * Design pads about a half of the termination. * Fixture the board when using your pizza cutter.
Used SMT Equipment | Chipshooters / Chip Mounters
The NXT III is a modular SMT mounter that is able to provide the best line every time for factories that have such kinds of frequent changes for producing electronics devices. Heads can be exchanged easily. Heads can be exchanged easily without tool
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411, Samsung SM411 Mounter, Second-hand Samsung SM411 Chip Shooter Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH an
Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Parts & Supplies | Assembly Accessories
JUKI HIGHT SPEED SHOOTER KE2050 KE2060 KE2070 KE2080 KE1070 KE1080 FX-1R FX-2 FX-3 Sell & Buy smt machine and spare parts. Pls don't hesitate to contact me if you have any require,or wanted to sell smt machine. KE-3010 Speed The KE-3010 is
Parts & Supplies | Assembly Accessories
Samsung CP Feeder; CP8 * 2MM CP8 * 4MM CP12 MM CP16 MM CP24 MM CP32 MM CP44 MM CP56 MM Samsung CP Feeder Accessories; Feed gear, pressure cover, lock buckle, connecting rod, push rod, spacing screw, beak, one-way bearing, roll wheel, spring, etc..
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
Technical Library | 2010-05-06 18:46:29.0
Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics packaging industry. In those early days, components were fairly large, making the board design and printing process relatively simple. The current trend in product miniaturization has led to smaller and more complex board designs. This has resulted into designs with maximum area utilization of the board space. It is not uncommon, especially for hand held devices, to find components only a few millimeters from the edge of the board. The board clamping systems used in the printing process have become a significant area of concern based on the current board design trend.
FKN Systek K3000 - Singulate scored and skip scored panels up to 24" long ESD protective mat on back table Adjustable front and back support table Singulate panels with components up to 2.5" high Available in 18" blade (standard) or 24" blade (
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Thu Apr 07 00:00:00 EDT 2022 - Thu Apr 07 00:00:00 EDT 2022 | Palm Bay, Florida USA
Space Coast Chapter Technical Meeting: Printed Wiring Board Fabrication Design Attributes
Events Calendar | Tue Feb 05 00:00:00 EST 2019 - Thu Feb 07 00:00:00 EST 2019 | Anaheim, California USA
Pacific Design & Manufacturing
Career Center | Melbourne, Florida USA | Engineering,Production
Mechanical Engineer Candidate will work in the Advanced Manufacturing Technology organization executing the development, qualification, and implementation of leading-edge manufacturing processes across a broad range of applications and support manufa
Career Center | San Jose, California | Engineering,Management
Director of Hardware Engineering & Systems Engineering This is a cutting edge opportunity to bring your current or very recent experience from a leading OEM such as Dell, HP/Compaq, Apple, or other leading PC, Notebook, and Storage and Server manufa
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Career Center | Shoubra Misr, Cairo, Egypt, Egypt | Engineering,Maintenance,Production,Quality Control
Refer to my CV
