New Equipment | Test Equipment
MUST System III – Solderability test system (wetting balance) tests to IEC 60068-2-54 and 60068-2-69, MIL-STD-883 Method 2022, IPC/IEC J-STD003A, IPC/IEC/JEDEC J-STD-002B and EIA/JET-7401. Includes everything needed for all forms of solderability t
New Equipment | Test Equipment
“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations. After the dip process, the operator inspects the terminatio
Electronics Forum | Mon May 05 11:20:10 EDT 2014 | pankyb1261
Hi, I was wondering if there is a preferred source of the .635mm ceramic substrate specified in the J STD 002 Test S and if there is what is the typical size folks are using (3" x 3"?). Thanks, Rich
Electronics Forum | Mon May 24 08:49:29 EDT 2004 | davef
ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2012-08-22 15:57:01.0
IPC – Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC Midwest Conference & Exhibition
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
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