New Equipment | Test Equipment
MUST System III – Solderability test system (wetting balance) tests to IEC 60068-2-54 and 60068-2-69, MIL-STD-883 Method 2022, IPC/IEC J-STD003A, IPC/IEC/JEDEC J-STD-002B and EIA/JET-7401. Includes everything needed for all forms of solderability t
New Equipment | Test Equipment
Meets ANSI-J-STD002, ANSI-J-STD003, JEDEC JESD22-B102D, MIL-STD-202, IEC-68-2-54. Complete monitoring and control of steam or water temperature. Features include: Automatic timing of the test duration, digital indicator for elapsed time and cycle tim
Electronics Forum | Mon May 05 11:20:10 EDT 2014 | pankyb1261
Hi, I was wondering if there is a preferred source of the .635mm ceramic substrate specified in the J STD 002 Test S and if there is what is the typical size folks are using (3" x 3"?). Thanks, Rich
Electronics Forum | Mon May 24 08:49:29 EDT 2004 | davef
ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2012-08-22 15:57:01.0
IPC – Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC Midwest Conference & Exhibition
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Die-Catalog-800-000.pdf
. Component Forming Dies CF-8 61 1 H oll ing sw ort h S tre et Gr an d J un cti on , CO 81 50 5 Tel : (9 70 ) 2 45 -04 08 F ax : (9 70 ) 2 45 -96 74 We b: ww w.g pd -gl ob al.c om GPD Part No. 800-000 # = requires purchase of secondary exit chute package
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
phases in the Pb-free microstructure. RESULTS Solder Joint Void Characterization The factory x-ray inspection on the conventional or standard SMT (STD SMT) reflow assembly revealed substantial void content in the BGA solder joints of both components. The x
.gif)
