Industry Directory: j-std-033c (2)

Super Dry

Industry Directory | Manufacturer

Design and Manufacture Desiccant Dry Cabinets for low humidity storage and baking of moisture sensitive components, PCBs, electronic materials, lab samples, digital media and medical devices.

SMT Dry Cabinets by Eureka Dry Tech

Industry Directory | Consultant / Service Provider / Manufacturer

Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.

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New SMT Equipment: j-std-033c (1)

Eureka TUS-1001 Fast Super Dryer Dry Cabinet

Eureka TUS-1001 Fast Super Dryer Dry Cabinet

New Equipment | Board Handling - Storage

Eureka TUS-1001 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-1001 Model: TUS-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing

SMT Dry Cabinets by Eureka Dry Tech

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Electronics Forum: j-std-033c (6)

Baking MSDs in tubes?

Electronics Forum | Sun Mar 25 22:21:03 EDT 2007 | sleech

Let me explain. At 125 degrees C, the oven is above the boiling point of water. It will be vaporized and eventually be vented from the oven. However at temperatures of 90 degrees c and lower the relative humidity becomes an issue. For the life of me,

moisture sensitive components/packaging

Electronics Forum | Wed Sep 23 14:30:05 EDT 2015 | deanm

"...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the packaging bulk and enhance carton packing (Figure 3-6). Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lea

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Industry News: j-std-033c (21)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

IC Packages and LEDS Can Be Stored in a Dry Storage Cabinet for Indefinite Floor Life

Industry News | 2017-10-24 17:22:53.0

Seika Machinery is pleased to announce that IC packages and LEDs can be stored in a dry box at five percent RH or less for indefinite floor life. Five of the McDry storage cabinets offer less than one percent RH, including: DXU-1001, MCU-201, MCU-301, MCU-401 and the DXU-580SF Feeder Storage Cabinet.

Seika Machinery, Inc.

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Partner Websites: j-std-033c (1485)

KV8-M71S0-50X YV100X Nozzle Shaft KV8-M71S0-00 STD Shaft 1 Spare Parts

KingFei SMT Tech | https://www.smtspare-parts.com/sale-35518965-kv8-m71s0-50x-yv100x-nozzle-shaft-kv8-m71s0-00-std-shaft-1-spare-parts.html

KV8-M71S0-50X YV100X Nozzle Shaft KV8-M71S0-00 STD Shaft 1 Spare Parts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

phases in the Pb-free microstructure. RESULTS Solder Joint Void Characterization The factory x-ray inspection on the conventional or standard SMT (STD SMT) reflow assembly revealed substantial void content in the BGA solder joints of both components. The x

Heller 公司

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