Industry Directory | Consultant / Service Provider
We work on the physical design, reliability and failure analysis of electronic components, solder joints and PCB assemblies. We provide expertise in the assessment of both standard SnPb and Pb-free solder joint reliability.
Industry Directory | Consultant / Service Provider
Serving the Educational Needs of Modern Technologies
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Test Equipment
Hanwha SM471 Plus SMT Assembly Line Hanwha SM471 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:78000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach
Electronics Forum | Tue Feb 08 04:27:55 EST 2011 | thomas111
hi, I am a Hardware designer . One of my products is undergoing a Reliability test in which a resistor shows a high value on board from its specified value .However it retains the original value when its cooled under room temperature. The resistor
Electronics Forum | Tue Jun 25 09:45:39 EDT 2019 | edhare
See also ... https://www.semlab.com/solder-joint-failure-modes/
Used SMT Equipment | X-Ray Inspection
Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Vintage: Year 2014 PCB Direction: Left to Right Condition: Refurbished, working Running Hours: Series Number:X215914 Missing Parts: No Warra
Used SMT Equipment | Pick and Place/Feeders
With the SIPLACE SX we have made our most successful placement solution even better: Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily The SIPLACE SpeedStar for high-speed and placement of component
Industry News | 2003-04-25 08:11:22.0
Diluted earnings per share for the quarter were $0.36 compared to the $0.24 earned in last year�s first quarter.
Parts & Supplies | SMT Equipment
Lead Cutting Machine - Capacitor Cutter 301 Specifications This lead forming machine is used to lead-cutting and forming of taped resistors, diodes, and other axial components. FEATHERS 1. It is used to cut radial leads of bulk radial
Parts & Supplies | General Purpose Equipment
Lead Cutting Automatic Taped C-306C Specifications This lead forming machine is used to lead-cutting and forming of taped resistors, diodes, and other axial components. FEATHERS 1. It is used to cut radial leads of bulk radial compone
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Thu Aug 20 00:00:00 EDT 2020 - Thu Aug 20 00:00:00 EDT 2020 | ,
Avoiding the Most Common PCB Failure Modes
Career Center | Wellsboro, Pennsylvania USA | Engineering
SMT PROCESS ENGINEER: (Wellsboro, PA) - Designs, defines and plans the manufacturing process. Specifies and directs installation of new processes. Plans equipment build schedules and monitors vendor progress. Defines and recommends equipment, methods
Career Center | Williamsport, Pennsylvania USA | Engineering,Management
PRIMUS Technologies Corporation is an electronic manufacturing services (EMS) provider that produces highly reliable products for global government and commercial markets. Our company is an integrated lean enterprise that fully embodies the Six Sigma
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu
Career Center | Derabassi, India | Maintenance,Management,Production,Quality Control,Sales/Marketing
PCB Assembly (SMT & PTH)--Process/Planning – Production – Maintenance/Troubleshooting – QA/QC
SMTnet Express, February 19, 2015, Subscribers: 22,404, Members: Companies: 14,224, Users: 37,735 Numerical Study on New Pin Pull Test for Pad Cratering Of PCB Billy Hu, Jesus Tan - Flextronics Pad cratering is an important failure mode besides
SMTnet Express, October 30, 2014, Subscribers: 23456, Members: Companies: 14075, Users: 37030 Solder Joint Reliability Under Realistic Service Conditions. P. Borgesen, S. Hamasha, M. Obaidat, V. Raghavan, X. Dai; Binghamton University, M. Meilunas
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/x-ray-solder-joint-inspection
X-Ray Solder Joint inspection SELECT Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Overview - All Novo 102 Novo 103 Novo 300 Novo 460 Cerno 102IL Cerno 103IL Cerno 300S Cerno 508.1 Integra 508.2 Integra 508.3 Integra 508.4 Integra
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
], which is the major wear-out failure mode and major source of failure for surface mount (SMT) components in electronic assemblies [8]. A specific type of voiding called planar microvoiding has been shown to lower reliability either by effectively reducing the attachment area or by weakening the solder in regions of the solder joint
