Industry Directory | Manufacturer
Ping You Industrial Co.,Limited.is specialized in supply Surface-Mount Technology pick & place equipments and supports most major brands of electronic assembly equipments
4000675 TIMING BELT XM 2 40001116 TIMING BELT T 4 40001143 TIMING BELT Z 4 40001160 TIMING BELT IC Z 1 40000947 TIMING BELT 1 40001023 TIMING BELT(L) 1 40001023 TIMING BELT(L) 1 E2155725000 AWC BELT (M/L) 1 E2160725000 AWC BELT (E) 1
Used SMT Equipment | Pick and Place/Feeders
JUKI Mounter fx-1r parameters: Board size: 410*360mm Component height: 6mm 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) Two independent multi-nozzle laser heads (8 total nozzles) from 0603 （0201） to 20mm square components or 26.5×
Used SMT Equipment | General Purpose Test & Measurement
SMT Intelligent Feeder Calibration Jigs CAN Install Different Brands Feeder Product Specifications/Features Name of commodity: intelligent Feeder calibration jigs Weight :45KG (net weight) the size of goods (mm): L540*W350*H600 Power sup
Parts & Supplies | SMT Equipment
MPM 1014951 timing printer belt More SMT parts available H1067R A12GD25-1L-Z FUJI CP6 Solenoid valve H1068Z PCD2413-NB-D24 FUJI CP643 13 Solenoid valve H1082T RCS-242-M3-D24MP Solenoid valve H1084A SS23H-M5-D24-UPK Sensor H1124D FUJI XP242 243
Parts & Supplies | Assembly Accessories
DEK belt (107058) TIMING More SMT parts available H1067R A12GD25-1L-Z FUJI CP6 Solenoid valve H1068Z PCD2413-NB-D24 FUJI CP643 13 Solenoid valve H1082T RCS-242-M3-D24MP Solenoid valve H1084A SS23H-M5-D24-UPK Sensor H1124D FUJI XP242 243 Soleno
40000682 XA PULLEY BASE 40000683 XA PULLEY BRACKET R ASS 40000684 XA PULLEY BRACKET R 40000685 X MOTOR ASSY(TS4613N1020E2 40000688 TIMING BELT XB 40000695 Y AXIS FRAME (M) ASSY 40000700 LINEAR WAY Y 40000701 Y EXTENDED FRAME L (L) 40000702 Y
Career Center | Senai, Johor Malaysia | Engineering,Production,Quality Control
A Six Sigma Green Belt practitioner with high experience in process,quality and production engineering.
Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
