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Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef
You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
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