Industry Directory | Manufacturer
Bosch Static Control is a specialist in ESD & CLEANROOM Production Items and has several years experience in this specialist field.We have our very own production Facilties in Dongguan, China
The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli
Pyralux® LF Copper-clad Laminate DuPont™ Pyralux® LF has been an industry standard in high reliability applications in the avionics industry for over 30 years and has a proven record of consistency and dependability and is ideal for aerospace and m
Electronics Forum | Wed Jan 22 10:24:23 EST 2014 | cyber_wolf
No matter how good your process is, you will get solder on the gold fingers/lands unless they are protected. We have proven that solder will get on the gold fingers in the reflow oven. How that happens....we arent't 100% sure...there are a lot of the
Electronics Forum | Fri Nov 13 20:17:35 EST 1998 | Chuck Garth
| | I believe that gold fingers on my circuit boards are being | | contaminated and need to clean them with some chemical | | solution. Any recommendations. | | | Chuck: What is the type and source of your contamination? Dave F | We are using a s
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
Technical Library | 2021-08-18 01:30:18.0
The interfacing of soft and hard electronics is a key challenge for flexible hybrid electronics. Currently, a multisubstrate approach is employed, where soft and hard devices are fabricated or assembled on separate substrates, and bonded or interfaced using connectors; this hinders the flexibility of the device and is prone to interconnect issues. Here, a single substrate interfacing approach is reported, where soft devices, i.e., sensors, are directly printed on Kapton polyimide substrates that are widely used for fabricating flexible printed circuit boards (FPCBs).
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
. If this helps, the laminate is flex kapton. Read Answer Cup Terminal Soldering Requirements Question: I have a couple of questions regard cup terminals
