70 percent of SMT manufacturing defects are caused during the solder paste printing process. Detection of these printing defects can greatly increase the overall quality of finished products and decrease the human hours associated with post-process r
FX-940 ULTRA 3D AOI - Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA
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