New Equipment | Test Equipment
CascadeTEK's Colorado and Oregon Test Facilities Offer HALT and HASS Testing. (Highly Accelerated Life Test) (Highly Accelerated Stress Screen) testing methods are an excellent tool to quickly uncover latent weaknesses in a product. Cascade TEK’s
Strata-Shield ENV� prevents ESD damage of all known categories during transportation and storage: Catastrophic failure Latent failure Mechanical damage Strata-Shield ENV� protects your ESDS in accordance with EN 61340-5-1: Low Charging Dissipative S
Electronics Forum | Wed Aug 07 16:06:48 EDT 2024 | SMTA-64386252
Hello, You should contact your PCB suppliers and ask them. Most of PCB suppliers did not recommend exposing PCBs to more than 5 thermal cycles.
Electronics Forum | Fri Jul 12 07:15:45 EDT 2024 | murtaza
Use high tg material on pcbs. Like tg170 or higher. Its a bit more expensive. Board shops usually quote cheapest material just to win the order. When you see fr4 on the quote it usually means tg135-tg140.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Parts & Supplies | Soldering - Wave
Spray-on Fluxer Device TAF40-12V, TAF40-15PV This is an automatic spray device to apply the post-flux: It is used in order to better soldering effect when you use the Wave Soldering Device (below). You can change the amount of the post-flux qui
Parts & Supplies | Soldering - Wave
Spray-on Fluxer Device TAF40-12V, TAF40-15PV This is an automatic spray device to apply the post-flux: It is used in order to better soldering effect when you use the Wave Soldering Device (below). You can change the amount of the post-flux qui
Technical Library | 2016-03-31 17:39:52.0
Electrical overstress causes damage to sensitive components, including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analyses sources of such noise, how it affects components and how to mitigate this problem.
Technical Library | 2021-03-10 23:57:29.0
Latent short circuit failures have been observed during testing of Printed Circuit Boards (PCB) for power distribution of spacecraft of the European Space Agency. Root cause analysis indicates that foreign fibers may have contaminated the PCB laminate. These fibers can provide a pathway for electromigration if they bridge the clearance between nets of different potential in the presence of humidity attracted by the hygroscopic laminate resin. PCB manufacturers report poor yield caused by contamination embedded in laminate. Inspections show ...
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Thu Aug 23 00:00:00 EDT 2018 - Thu Aug 23 00:00:00 EDT 2018 | ,
Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
SMTnet Express, March 31, 2016, Subscribers: 24,152, Companies: 14,760, Users: 39,935 EMI-Caused EOS Sources in Automated Equipment Vladimir Kraz; OnFILTER, Inc. Electrical overstress causes damage to sensitive components, including latent damage
Blackfox Training Institute, LLC | https://www.blackfox.com/everything-you-need-to-know-about-esd-management/
: catastrophic and latent failure. Catastrophic failure is the more visible type of static damage, like melting or explosion, both of which immediately damages a device’s circuitry
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. For applications where the BGA may be subjected to regular shocks (for example in a mobile phone) mechanical pull and shear testing ensures adhesion strength is acceptable and protects against future latent failures. More information
