Electronics Forum | Mon Sep 27 15:57:21 EDT 2010 | mikesewell
I've owned two PDR Lightmaster IR rework stations (bought at 2 diff. companies) and have been extremely happy with them. Closed loop,separate control of top and bottom heater via non contact thermocouples. Control the process, not the product - set
Electronics Forum | Sun Jan 24 19:53:54 EST 1999 | Steve Gregory
| It has been known that sufficient cooling after soldering is important in order to get a stronger joint during its solidification stage. And it has been so much emphasised with reflow oven. But, why many models of wave soldering machine do not come
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2017-01-09 18:20:54.0
EVS International will showcase the new EVS 500LF lead-free version and EVS 8KLFHS in the Sono-Tek booth (#2700) at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif.
Parts & Supplies | Soldering - Wave
Spray-on Fluxer Device TAF40-12V, TAF40-15PV This is an automatic spray device to apply the post-flux: It is used in order to better soldering effect when you use the Wave Soldering Device (below). You can change the amount of the post-flux qui
Parts & Supplies | Soldering - Wave
Spray-on Fluxer Device TAF40-12V, TAF40-15PV This is an automatic spray device to apply the post-flux: It is used in order to better soldering effect when you use the Wave Soldering Device (below). You can change the amount of the post-flux qui
Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
Events Calendar | Thu Aug 23 00:00:00 EDT 2018 - Thu Aug 23 00:00:00 EDT 2018 | ,
Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
SMTnet Express, March 31, 2016, Subscribers: 24,152, Companies: 14,760, Users: 39,935 EMI-Caused EOS Sources in Automated Equipment Vladimir Kraz; OnFILTER, Inc. Electrical overstress causes damage to sensitive components, including latent damage
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. For applications where the BGA may be subjected to regular shocks (for example in a mobile phone) mechanical pull and shear testing ensures adhesion strength is acceptable and protects against future latent failures. More information
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. A lack of proper control will result in internal component damage during reflow due to moisture expansion. This will typically create insidious latent component defects that can escape inspection and test
