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Industry Directory | Manufacturer
PCB Global is a dedicated Prototype Quick Turn High Tech. PCB supplier - Quotes and orders can be processed 24/7/365 - free online quotation visit www.pcbglobal.com
New Equipment | Solder Materials
Ceasolder-PAL (Pink Acrylic Latex) Peelable Acrylic Latex Solder Mask Ceasolder-Pal is a temporary, peelable solder mask comprised of a thixotropic, synthetic acrylic latex designed to withstand fluxing, wave soldering and cleaning operations. Unli
FR-4 Material 1. 0 mm Thickness 1oz copper thickness 4 Layers HASL Surface Treatment Green Solder Mask e-test
Electronics Forum | Mon Nov 09 16:55:33 EST 1998 | Doug Clement
I have a need to dispense a latex masking material using an automated dispensing system. We are presently looking at the I&J750. Does anyone have any experience with this piece of equipment, or have a better solution available?
Electronics Forum | Tue Nov 10 12:47:06 EST 1998 | Dave F
| I have a need to dispense a latex masking material using an automated dispensing system. We are presently looking at the I&J750. Does anyone have any experience with this piece of equipment, or have a better solution available? | Doug: Fisnar m
Industry News | 2015-01-02 09:12:06.0
ACL, Inc. introduces #8691 Mighty Mask, a fast-curing, temporary masking agent for safeguarding components during conformal coating processes and component-free areas on PCBs during soldering.
Industry News | 2008-10-29 17:30:39.0
Greeley, CO � October 2008 � Florida CirTech Inc., a leading chemical blender to the Printed Circuit and Electronic Assembly industry, announces that it recently developed the CK300 - Catalyst Killer.
Parts & Supplies | Circuit Board Assembly Products
1) 36*36mm/1up, Aluminium type: A5052 2) Thermal conductivity: 0.8-1.3 W/mk, 3) Single sided, 1.6mm 4) White solder mask/ Black Legend 5) Copper weight: 35μm 6) Surface Finish: ENIG 7) Profile: Punch
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Larg volum, punch contour.
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
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