Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Tue Mar 30 12:27:40 EDT 2021 | chicagoindustrial
This is correct. We don't know if you are looking across the components or referencing a point they are not even connected to.
Electronics Forum | Thu Dec 17 08:27:09 EST 2020 | gort
Hi all Wonder if anyone can help , I'm trying to test a pcb board ( with very little experience) I've tested the resistors and now the capacitors , only to find that about 5 of them have continuity so guessing there not working . I checked the s
Used SMT Equipment | Soldering - Wave
2005 Speedline Technologies Vectra 450F Wave Solder Note: The solder pot is full of lead-free solder. The weight of this solder is estimated at 1600 lbs. Item Location: Westerville, OH USA Serial: 498509 Features: Ultra Fill Lead-Free OptiFlux II Int
Used SMT Equipment | General Purpose Test & Measurement
Optical Spectrum Analyzer Agilent 86142B Optical Spectrum Analyzer. Passes self test - no option. Best suited for WDM component and system test applications where power and wavelength accuracy, dynamic range and low polarization dependency are criti
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
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Parts & Supplies | Pick and Place/Feeders
CL 8mm feeder for 0201 component (with green handle) if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.
Parts & Supplies | SMT Equipment
The entire set of components measuring blade Name: 990314 MPM stencil measuring height; scraper height of the entire set of measured components; including cylinders, motors, contact switch Part Number: 990314 MPM stencil measuring height; scraper
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 5+ years of test design at the component, sub assembly, assembly and system level. ATE design, test software using Labview, optical and/or RF communications is preferred, OWDM,DC-48/192 highly desired. Duties/Functions: Takes le
Career Center | Fayetteville, Arkansas USA | Engineering,Production
I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/connectors
). Connector Testing USB connectors now live up to their name of being a truly universal serial lead. USB connectors are expected to reliably work for several years, despite regular insertion and withdrawals that can add up to hundreds of cycles
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_add-square-axial-lead-package-component-family_topic1778.xml
PCB Libraries Forum : Add Square Axial Lead Package Component Family PCB Libraries Forum : Add Square Axial Lead Package Component Family This is an XML content feed of
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