Industry Directory | Manufacturer's Representative
Representative company in Singapore/Malaysia/Thailand/Philippines/Indonesia/Vietnam/China
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
New Equipment | Rework & Repair Equipment
MLT provides laser decapsulation, "decap", services for removing encapsulation or mold compounds for accessing wirebonds, die, leadframes, and substrates.
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Electronics Forum | Wed Jun 26 22:05:35 EDT 2019 | SMTA-Chi Hong
Hello all, Recently there is component SOIC8L HD leadframe with the exposed Cu on shoulder side and lead tip. Is anyone have experience running with this type of component?Thanks
Electronics Forum | Fri Apr 19 08:46:04 EDT 2002 | geoff_goring
I would like to discover more about Zinc/Lead diffusion in the leadframes of SOIC ASICS.
Used SMT Equipment | Semiconductor & Solar
DMC Leadframe Marker
Used SMT Equipment | Semiconductor & Solar
Leadframe Transport Conveyor
Industry News | 2024-03-11 15:00:03.0
Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Technical Library | 2021-04-01 14:36:51.0
This document provides information about the Surface Mount Technology (SMT) board assembly of Infineon Thin Small Non-leaded Packages (TSNP). The specific dimensions of the leadframe based inner setup depend on the size of the chip and the type of bonding. The field of application ranges from linear voltage regulators for weight-limited applications such as cellular phones and digital cameras to linear voltage regulators for the automotive sector.
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
