Industry Directory | Manufacturer's Representative
MiniATE Systems represents world class manufacturers of high quality IC Sockets & Connectors for Test & Burn-in, Development and Electronic Production.
Industry Directory | Consultant / Service Provider
assembly and test services COB,DIP,LCC,PGA,RF etc.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Electronics Forum | Fri Sep 02 15:21:34 EDT 2005 | pr
Do you have a cube down the hall from me? I think it's already been forgotten, but when blindsided by these requests one has to do SOMETHING! I blasted one in reflow and did a 7 second solder bath dip with another and took pictures, nobody has asked
Electronics Forum | Thu Feb 11 15:04:59 EST 2016 | cinthiaap
What is the most appropriate method to solderability test in OSP surface finish PCB? I have used Edge Dip for Surface Features testing, but the results are failed in some features. I haven't also found standards to OSP surface finish. Thank you for n
Used SMT Equipment | General Purpose Test & Measurement
Hepco 7900-LF3 DIP Lead FormerSN: 1703 General specs:Series 7900 Convertible DIP Lead FormersAutomatically Adjusts for Body Thickness Variations.One Machine for .300", .400" and .600" DIPS Fast, Simple Conversion - Under 2 Minutes.Fixed Tooling Means
Used SMT Equipment | THT Equipment
Universal model 6796A Dip Insertion system. .300" component insertion with 72 Inputs ultra reliable. Available as Used machines to full Remanufactured. We supply all Universal through hole system. -Video is available of our final testing popu
Industry News | 2003-06-03 08:20:48.0
Designed for fast and easy DIN-rail mounting
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Parts & Supplies | Assembly Accessories
TEST PCB LP3 ..00359534-01 Tester PEL-2002A Push pull tester NK-500 Neon lamp tester SX-C Test Probes (Universal Probe) TL20 Probes Connector Test Point temp (Male) SMPW-K-M. DIP TESTER DS-10
Parts & Supplies | Assembly Accessories
TEST PCB LP3 ..00359534-01 Tester PEL-2002A Push pull tester NK-500 Neon lamp tester SX-C Test Probes (Universal Probe) TL20 Probes Connector Test Point temp (Male) SMPW-K-M. DIP TESTER DS-10
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
Technical Library | 2017-08-17 12:23:27.0
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.
ETA DIP Inverted Camera Online AOI Machine ETA-V5200 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m
DIP Online PCBA AOI Machine ETA-V320 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI inspe
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Training Courses | | | IPC-A-610 Trainer (CIT) Recert.
The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.
Career Center | South Windsor, Connecticut USA | Engineering,Technical Support
Posting code: JK-NVPT Title: Process Technician(PCB Assembly and support) Our client, located in northern Connecticut, seeks a Process Technician Provide diversified technical support to Engineering or Manufacturing in the analysis and maintenance of
Career Center | Shenzhen, China | Engineering,Production
Job requirements & responsibilities: 1. High school education or above 2. Above 5 years of relevant work experience in the PCB assembly industry 3. Familiar with electronic component testing, component identification and judgment and working
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
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