New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Electronics Forum | Thu Sep 10 15:06:11 EDT 2009 | dyoungquist
My guess is that he is talking about the gold plated pads not fully wetting with solder. We have seen this on some of our ENIG boards with the gold still showing at the far corners of the rectangular pads. Not knowing if this is hand soldering or p
Electronics Forum | Wed Apr 13 12:10:47 EDT 2022 | winston_one
Hello! We have a strange effect. Some pads of big trough-hole DDR slot just dessapear. Initialy it was soldered with selective soldering process (leaded, 290 degrees, ImSn finish, very short storage). Then some connectors with poor barrel fill we hav
Industry News | 2009-04-23 20:54:01.0
MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:
Industry News | 2016-09-22 17:27:09.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.
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Parts & Supplies | SMT Equipment
We also supply following Panasonic Spare parts : KXFB02GBC06 FRAME KXFB05CGA01 BOLT N210009258AA PLATE KXFB02GJA00 BLOCK KXFB02GKA00 BLOCK N210018293AA COVER N210018294AA COVER N210018299AA COVER KXFB02NSA00 BRACKET KXFB02NVA00 DOG KXFB02
Technical Library | 2019-04-17 21:29:14.0
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. The lateses processes, materials, equipment and techniques for rework of BGA, QFN, LGA, PoP and other SMD components. Key Topics Include: A review of the parameters for establishing a safe thermal profile
| https://pcbasupplies.com/s3x58-m650-7-600gm/
residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate. Resistance between Probe and PCB Superior wetting ability prevents voiding For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a
