Industry Directory | Manufacturer
Ceramic and organic packaging and package assembly. Flip Chip, Wirebond, Lidding for a wide range of devices and applications from power semiconductors, ASICs, to complex modules.
Industry Directory | Manufacturer
Automotive Electronics and Lighting design and manufacturing
Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di
The DV-8000C series Heli-Flow® pumps are the newest generation of encoded auger pumps. The pump has a fixed-head design for luer needle applications. The DV-8000 pump's rigid head and fluid path can withstand high pressures generated by thick fluids
Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund
We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S
Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Used SMT Equipment | Board Cleaners
Electrovert Model Number: Aquastorm 200 Year 7/2008 Prewash Flow Meter Final Rinse Flow Meter Electro Air Knife Drying Dual Hurricane Package Level 2 Chemical Isolation Rear Gauages 15 HP Blower IR Heaters Sump Tank for machine Sump Tank
Used SMT Equipment | Pick and Place/Feeders
Universal Instruments Polaris Machine For Sale Very clean and in Good Condition See attached pictures and information below Polaris Model Number: 7514A Equipment Number: 10076306 Year 2008 Travel: 550 mm x 800mm Repeatability: +/- 0.01
Industry News | 2020-07-01 12:08:16.0
For high precision low stress PCB singulation of panels with sensitive components near the parting edge, and with the smooth edge finish required by military specifications or by packaging considerations, using a Diamond Blade Saw beats routing for speed and for blade life. The saw blade, a 2.95" (75mm) diameter .021" thick diamond coated cutting disk, provides a low-stress, ultra smooth edge finish for separting panelized Printed Circuit Cards. ts which overhang the parting line will remain intact.
Industry News | 2016-09-30 05:38:43.0
In this newsletter we describe a new method of testing the seal and adhesive quality of a lid encapsulated devices.
Parts & Supplies | SMT Equipment
DEK alcohol gourd lid (119664) Description: DEK alcohol gourd lid CAP, TANK Part NO.: 119664 Kindly contact me if you are interested. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086-13170471806
Parts & Supplies | SMT Equipment
DEK alcohol gourd lid CAP, TANK Part NO.: 119664
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2018-12-19 21:23:59.0
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste.
E86017230B0 ATS CONTROL BOARD E86017250A0 CONTROL PWB ASM. E8601725AA0 CONTROL PWB ASM. E86017260A0 MTC CONTROL BOARD E8601726AA0 CLT BOARD AA ASM E86017270A0 BACK BOARD ASM E86017290A0 SAFETY BOARD ASM. E86017290B0 SAFETY BOARD B ASM.
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
and MEMs lid-attach technology, it is becoming increas
Heller Industries Inc. | https://hellerindustries.com/parts/591151/
591151 - Lid, Safety cover Air (Short) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
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