25 Sealants LOCTITE 5210 One-component ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applic
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya
I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.
Electronics Forum | Tue Feb 24 16:05:58 EST 2015 | alexeis
Hi, The best way is to sort your components for each shape type by expiration date and than by delivery date. This will give exactly what you need to reorganize from lifo to fifo. Best Regards, Alexei
Industry News | 2020-05-27 15:54:35.0
Blackfox is opening its facilities to in-person training for the electronics manufacturing industry with a thorough and documented safety plan for all. If preferred, Blackfox is also offering online IPC training and certification in either English or Spanish from the comfort of your home or office.
Industry News | 2003-04-04 08:46:37.0
Company Announces Further Reductions to Goodwill and Reclassifications of Indebtedness Recorded in Fiscal 2002
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
www.mojesmt.com
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/trial-license-expired-error-message_topic1657.html
:25am If you encounter the "Trial License Expired" message and you purchased the Library Expert Pro (perpetual license): Single User: Check to make sure the key is properly connected to the USB port and the light is on
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/k1091a-cam-follower-loctite-262-181752?page=66&category=1145
FUJI CAM FOLLOWER LOCTITE 262 K1091A | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Others SMT parts CAM FOLLOWER LOCTITE 262 Public Pricelist
