Industry Directory: low bakeout temperature (44)

NASCENTechnology Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

NASCENTechnology has patented LTCC (Low Temperature Co-Fired Ceramics) transformers. These components allow high reliability and durability with an unbelieveable low profile package to allow integration into your size sensitive design.

Parelec Inc.

Industry Directory |

Parmod�, Parelec Inc�s patented conductive ink technology, enables the formation of continuous-phase pure metallic conductors at relatively low temperature�making them suitable for application to polymer substrates.

New SMT Equipment: low bakeout temperature (208)

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Electronics Forum: low bakeout temperature (449)

How low temperature solder joint can survive

Electronics Forum | Thu Jan 08 15:49:10 EST 2015 | emeto

I bet you that the problem comes from the ENIG brittle solder joints. About low temperatures I think you can go to the absolute 0 and the device should still work.

How low temperature solder joint can survive

Electronics Forum | Wed Jan 07 17:39:26 EST 2015 | duchoang

Additional info: I use SAC305 solder paste on Enig PCB.

Used SMT Equipment: low bakeout temperature (56)

Juki KD - 775 JUKI chip mounter

Juki KD - 775 JUKI chip mounter

Used SMT Equipment | SMT Equipment

Product name: KD - 775 JUKI chip mounter Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standard equipped with three dispensing head, achieved 0.1 seconds/launch daub adhesive at a high speed. Stable quality stand

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Vitronics Centurion CT820

Vitronics Centurion CT820

Used SMT Equipment | Soldering - Reflow

Make: Vitronics Soltec Model:  Centurion CT820 Vintage:  2019 Description: Reflow Oven Details: Edge Rail & Mesh Belt Conveyors Air 8 Heating Zones 2 Cooling Zones KIC Profiler Total Heating Length: 111.8 Max Gas Temperature Set Point: 350°C Auto Ch

Lewis & Clark

Industry News: low bakeout temperature (1056)

GPD Global's PCD4 Dispense Pump Now Is Available in Europe and Asia/Pacific

Industry News | 2012-04-06 15:32:39.0

GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.

GPD Global

Jetting Is Redesigned with GPD Global's NEW NCM5000 Dispense Pump

Industry News | 2013-07-22 09:54:27.0

GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.

GPD Global

Parts & Supplies: low bakeout temperature (35)

KIC KIC 2000 furnace temperature curve instrument

KIC KIC 2000 furnace temperature curve instrument

Parts & Supplies | Assembly Accessories

Introduction of kic2000 furnace temperature tester Processing customization: Yes Brand: US KIC Model: kic2000 Measurement range: - 50-1050 (℃) Temperature measurement resolution: 0.1 ℃ Dimension: 320 * 86 * 26 (mm) Packing number: 1 t

KingFei SMT Tech

KIC KIC START Thermal Profile , SMT Thermal Profilling Image Reflow Profile 9 6 Channel Tester

KIC KIC START Thermal Profile , SMT Thermal Profilling Image Reflow Profile 9 6 Channel Tester

Parts & Supplies | Assembly Accessories

KIC START profiler,kic thermal profile,smt thermal profilling Image Reflow Profile 9 6 Channel Tester Accuracy: +/-1.2°C Resolution: 0.3 °C to 0.1 °C Internal operating temperature: 0 °C to 105 °C For thermocouples: 9/12 K Ty

KingFei SMT Tech

Technical Library: low bakeout temperature (43)

Revolutionize PCB Manufacturing with SMT Dispensing Machines

Technical Library | 2023-12-18 11:33:57.0

Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. ​In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications

Technical Library | 2013-01-24 19:16:35.0

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.

Christopher Associates Inc.

Videos: low bakeout temperature (261)

BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester

BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester

Videos

BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys

Shenzhen Honreal Technology Co.,Ltd

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

Events Calendar: low bakeout temperature (8)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Webinar: Solder Paste Evaluation & Simple Tricks of the Trade

Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,

Webinar: Solder Paste Evaluation & Simple Tricks of the Trade

Surface Mount Technology Association (SMTA)

Career Center - Jobs: low bakeout temperature (2)

Senior RF Circuits Design Engineer

Career Center | Brooklyn, New York USA | Engineering,Management

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

Manufacturing Technician III

Career Center | Tewksbury, Massachusetts USA | Production

Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Today we continue to grow and serve customers in an expanding variety of industries. What we do impacts the future of tech

Mycronic Technologies AB

Career Center - Resumes: low bakeout temperature (2)

SMT Manufacturing

Career Center | , | Engineering,Maintenance,Production

Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma

SMT Manager having 10 yrs in Electronic Manufacturing.

Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support

9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t

Express Newsletter: low bakeout temperature (503)

SMT Express, Volume 4, Issue No. 2 - from SMTnet.com

Article Return to Front Page A Low Temperature Alte

SMT Express, Volume 4, Issue No. 2 - from SMTnet.com

Article Return to Front Page A Low Temperature Alte

Partner Websites: low bakeout temperature (3268)

Dip Tinning Conductors with Low Temperature Insulation and Solder Pot Contamination - EPTAC - Train.

| https://www.eptac.com/faqs/ask-helena-leo/ask/dip-tinning-conductors-with-low-temperature-insulation-and-solder-pot-contamination

Dip Tinning Conductors with Low Temperature Insulation and Solder Pot Contamination - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Ultra Low II

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/ultralow.pdf

Ultra Low II the probability that air will be drawn into the oven against the current of escaping nitrogen. The velocity of the exiting nitrogen is governed by the simple relationship: M=VxAxD where M= mass flow, V= gas velocity, A

Heller Industries Inc.


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