Electronics Forum | Wed Sep 11 11:28:10 EDT 2019 | cyber_wolf
What is the error message ?
Electronics Forum | Thu Sep 12 16:37:26 EDT 2019 | emeto
If we assume Mycronic equipment, you have some erroe in your tray creation.
Industry News | 2011-08-29 16:34:08.0
Kyzen announces that Dr. Mike Bixenman along with Mark Northrup and Andy Buchan of IEC Electronics, Joe Russeau of Precision Analytical, and Tim Jensen of Indium Corporation will present “Cleaning Challenges in an HDI World” at the upcoming IPC Midwest Exhibition and Conference.
Technical Library | 2021-03-18 20:07:08.0
X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies.
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
SMTnet Express, April 20, 2017, Subscribers: 30,402, Companies: 10,575, Users: 23,153 High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing Tobias Sponholz, Lars-Eric Pribyl, Frank Brüning, Robin Taylor
3D ICs With TSVs - Design Challenges And Requirements 3D ICs With TSVs - Design Challenges And Requirements As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up to 3D ICs
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