Industry Directory | Manufacturer
FP Stencil Sdn. Bhd. is principally involved in the manufacture and sale of laser-cut metal surface- mount technology (SMT) stencils. Our products comprise of PCB stencils, wafer stencils, mini stencils, & accessories.
Industry Directory | Manufacturer
Multiaxis Distributed Motion Control uniquely integrating power and control into one compact module.
Product Description: Our laser depaneling machine is a specially designed pcb depaneling equipment with ultra-high accuracy and speed, perfect for cutting FR4 and FPC. This pcb board cutting machine is software controlled, which not only ensures a h
New Equipment | Test Equipment
IN-CIRCUIT TESTER PMP-818S Feature ▶Phase measurement technology ▶Optocoupler measurement technology ▶Current measurement technology ▶Multiple points measurement ▶Isoelectric separation point automatically ▶High voltage detecting and discharging te
Used SMT Equipment | Pick and Place/Feeders
Siemens placement machine D4I, SIPLACE D4i high-speed placement machine Model description: 1. Number of cantilevers: 4 2. Number of placement heads: 4 3. IPC speed: 57.000cph 4. SIPLACE benchmark evaluation: 66.000cph 5. Theoretical speed: 81.50
Used SMT Equipment | Pick and Place/Feeders
Placing 9,700 components per hour under optimal conditions, the user friendly Samsung CP20CVTM provides one of the highest Cost/Placement ratios in the SMT assembly equipment market. High speed of 0.37 sec/chip featuring On-the-Fly optical cente
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2001-10-18 11:52:16.0
IPC has announced the winner of this year's IPC Annual Meeting Best Technical Paper award. Mike Kittelson and Jess L. Pedigo, from Honeywell Advanced Circuits, received the Best Technical Paper award for A Review of Filling High Density, High Aspect Ratio Vias in A High Volume Printed Circuit Board Industry.
Technical Library | 2013-03-07 18:25:36.0
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2018-10-31 20:35:49.0
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. Copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards.Here we discuss innovative DC copper metallization formulations for hoist lines and VCP (Vertical Continues Plating) applications with high thermal reliability and throughput for high aspect ratio PCB manufacturing
IN-CIRCUIT TESTER PMP-818S Feature ▶Phase measurement technology ▶Optocoupler measurement technology ▶Current measurement technology ▶Multiple points measurement ▶Isoelectric separation point automatically ▶High voltage detecting and discharging te
Inline UV PCB Laser Depaneling Machine Inline UV PCB Laser Depaneling Instruction: PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics
Events Calendar | Mon Jul 10 18:30:00 UTC 2023 - Mon Jul 10 18:30:00 UTC 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Events Calendar | Tue Sep 10 18:30:00 UTC 2024 - Tue Sep 10 18:30:00 UTC 2024 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Career Center | , | 2018-02-22 12:50:43.0
Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on printed circuit card assemblies. • Ability to work from diagrams and drawings, make initial layouts, and use hand and/or pow
Career Center | , | 2018-02-22 12:51:59.0
Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on printed circuit card assemblies. • Ability to work from diagrams and drawings, make initial layouts, and use hand and/or pow
Career Center | BANGALORE, Karnataka India | Quality Control
New Model Evaluation • Testing & Evaluation of New TV models as per the relavant standards & release the defect free product for Mass Production • Measurement of audio parameters like Max out put, distotion, S/N ratio, hum, buzz etc • To conduct aud
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
(HDI) Finish Hole Size • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) True Hole Position +/-.0015" Finish Hole Size Tolerance • PTH - +/-.0015" • Non-PTH - +/-.001" Aspect Ratio (Board Tks./FHS) 30 Heavy Copper
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_stencil-paste-release-check_topic1990.xml
:- stencil thickness- paste type (grain size)- check for both aspect ratio and area ratio
