Industry Directory | Manufacturer
CPC Technologies Ltd. We are specializing in the Printed Electronics field, as well as in the Touch Panel/membrane switch manufacturing.
The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
SIPLACE D1 � Flexible Placement Machine With the flexible end-of-line machines SIPLACE D1 and SIPLACE D1s the SIPLACE team completes the new SIPLACE D-Series generation. The new placement machines can be alternatively equipped with one (SIPLACE D1s)
Electronics Forum | Tue Dec 11 19:48:37 EST 2007 | arun2382
Hi, If I were working with a 75 um thick stencil, Is there a spec. as to what the maximum value allowed on actual solder height measurements? Stencil type: Laser cut and electropolished Solder paste type: Type 4 Sn-Sb Would the measured values va
Electronics Forum | Thu Sep 26 23:14:25 EDT 2013 | zsoden
We picked up this old (circa late 80s) Seho 1135 machine last year for next to nothing. It needed a bit of TLC to bring it back to working order but it's 99% working now. The only problem left is that we cannot get sufficient height from the delta wa
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2022-09-26 07:14:47.0
MIRTEC, "The Global Leader in Inspection Technology," received a 2022 Mexico Technology Award in the category of Inspection – AOI for its all-new GENESYS-PIN 3D AOI System. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2021-12-21 14:45:26.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.
Parts & Supplies | Semiconductor & Solar
JUKI JX-100LED SMT machine parameters High speed SMT machine JX-100LED Size of substrate Min. 50*50 ~ Max. 800*360mm The substrate positioning mode only corresponds to the contour reference mode Component height 12.0mm Component size 0201 (metr
Parts & Supplies | Pick and Place/Feeders
1. Special feature 1.1 Placing heads ("auto-tools") are exchanged automatically during production：The XPF is the world's first machine to feature dynamic head exchange.The machine can switch between a high-speed placing head and a multi-purpose hea
Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
Career Center | Yishun, Singapore | Maintenance
To : Sir/Madam Subject: Apply for Job Dear Sir/ Madam, I write to enquire if there is a vacancy for a SMT Maintenance Engineer in your firm.I am 40 years old a permanent resident of Singapore with an IC # S6863162i and i'm still work
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
GPD Global | https://www.gpd-global.com/pdf/doc/Laser-Height-Sensor-22101449M.pdf
Laser Height Sensor User Guide Laser Height Sensor User Guide For use with P/N 22101438-0001, 22293215, 22293215-0001 The optional displacement Laser Height Sensor is interchangeable with the standard
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/how-to-monitor-and-track-height-sense-data
: Maximum Height Sense Height Sense Limits Height Sense Tracking But, what's the difference between them? The Maximum Height Sense (MHS) value is defined by the user via the software
