our products: 1) Non contact Coplanarity Measuring Module with Reflow Oven
Industry Directory | Consultant / Service Provider / Manufacturer
We are a premier TAPE AND REEL service. We have extensive capabilities for your SMT and Through Hole components. Also I.C. PROGRAMMING including flash memory. First articles provided free of charge.
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Thu Feb 20 17:18:24 EST 2003 | davef
Give us infortmation, please. What is [are]: * Height board to board side of the interposer on the low side of uBGA * Height board to board side of the interposer on the high side of uBGA * Alloy of solder balls, no paste was used correct? * Type of
Electronics Forum | Wed Apr 11 21:00:54 EDT 2018 | jacobidiego
What I mean is.... What Brand and Model should I buy to measure coplanarity between this 2 surfaces that could measure micrometers of difference I think that normal bubble levels are not precise enought for this use ^^
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YOUNG KY8030-2 3D SPI The World's Best-selling Full 3D Solder Paste Inspection Best-in-class measurement accuracy and inspection reliability Solves shadow problems by utilizing 2-way projection Provides accurate inspection data with real-time P
Used SMT Equipment | Pick and Place/Feeders
Panasonic NPM-W2 PCB mounter machine The new NPM-W2 amplifies the original NPM-W capabilities with a 10% throughput boost and 25% more accuracy. It also integrates new innovations like our incomparable Multi Recognition Camera. Combined, these feat
Industry News | 2011-10-03 15:37:21.0
The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place on Tuesday, October 18 during their annual conference, SMTA International
Industry News | 2011-08-17 12:59:10.0
The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00307884-01 Toothed Belt Synchroflex 16T2,5 00307922-01 BNC HF-PLUG ST 50 OHM 00308007-08 SIPLACE 80S CONTROL UNIT_ WITOUT MVS AND Y36,37 00308062-02 TRACK RULER 00308105-07 TAPE GAR
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00307884-01 Toothed Belt Synchroflex 16T2,5 00307922-01 BNC HF-PLUG ST 50 OHM 00308007-08 SIPLACE 80S CONTROL UNIT_ WITOUT MVS AND Y36,37 00308062-02 TRACK RULER 00308105-07 TAPE GAR
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
Technical Library | 2008-03-13 13:02:50.0
Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique.
See the easy-to-use, intuitive interface with touch control that facilitates minimal training and operator interaction. The SQ3000 3D AOI system maximizes ROI and line utilization with multi-view 3D sensors that capture and transmit data simultaneous
Dual Projection 3D In-Line SPI For High-Volume, Low-Mix Production The new KY8030-2 delivers 2x faster inspection without compromising performance and accuracy. Using patented dual projection, the system eliminates the critical Shadow problem that
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
SMTnet Express January 31, 2013, Subscribers: 26152, Members: Companies: 9105, Users: 34242 Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages There are three key industry trends that are driving
