Industry Directory | Distributor / Manufacturer
An international distributor of mechanical IC samples or "dummy" components, SMD production tools and equipment
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturer of robotic soldering equipment including contact, laser and ultrasonic soldering available in several robotic platforms including desktop, SCARA, cartesian and six axis multi-articulated robots.
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Smt I-pulse K01 nozzle used in pick and place machine Smt I-pulse K01 nozzle used in pick and place machine I-pulse series nozzles: 1.M1/M4 type:M001/M002/M003/M004/M005/M006/M012/M013/M017/M018/M019/M020/M021/M022/M031/M032/M033 2.M2 type:N001/N00
New Equipment | Education/Training
BEST IPC J-STD-001 training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This training ki
Electronics Forum | Fri Aug 24 08:49:54 EDT 2018 | davef
My first guess at the cause of your components skewing -- Termination pads on the board to not well match the the soldered terminals on the components, causing unbalanced wetting forces on the component terminations while the solder is molten.
Electronics Forum | Fri Aug 24 11:58:18 EDT 2018 | cupet
Hello davef, thank you for your reply. What do you think about the footprint for the diode on the first picture where the component is not assembled? There is good wetting on one pad of footprint and the other pad has bad wetting. This problem is not
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our MVP Machine Vision Products AOI Machines For Sale. We have a total of (4) MVP Automated Optical Inspection Machines and (2) Inspection Repair Stations.. They were taken off line due to company closer. All
Used SMT Equipment | AOI / Automated Optical Inspection
Description: Hello and thank you for your interest in our MVP AOI Machines For Sale.We have a total of (2)Ultra 18-20 MVP Automated Optical Inspection Machines,(1)CentOS based server. They were taken off line due to new machine installation would
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Danville, Illinois USA | Production
http://jobs-watchfiresigns.icims.com/watchfiresigns_jobs/jobs/candidate/job.jsp?jobid=1005&mode=view Overview: Watchfire Signs is a dynamic, exciting place to work. Our process engineers utilize their required Bachelors of Engineering and required
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 90, (#ts#)) SMT Express, Volume 3, Issue No. 12 - from SMTnet.com Volume 3, Issue No. 12 Wednesday, December 19, 2001
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/standard-chip-component-dimensions_topic1729.html
. The Height is the main driver of this component lead form. Issue: if you use a 0603 land pattern considering the highest package, you may be dumping too much solder on an 0603 that is 50
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/two-component-2k-products-mixers?con=t&page=6
: Safety and Specifications, Setup, Installing Pistons, Replacement Parts Tombstone Troubleshooting White Paper Nordson EFD This white paper discusses the issue of tombstoning when soldering PCB's
