Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
We are Massachusetts based Manufacturer's Representative Company that provides application engineering and technical sales support in New England.
Amkor Technology is the world's largest independent supplier of outsourced packaging and test semiconductor interconnect services; with more than 33 years of continuous improvement, growth and innovation. http://www.amkor.com
New Equipment | Test Equipment
Multitest is able to offer you the contacting solution that best suits your application including: Kelvin test RF test tri-temp test MEMS test for testing: packages with pitches down to 0.25 mm packages on strips or
New Equipment | Board Handling - Storage
EXATRON: Automated Component Handling, Testing, Laser Marking & Labeling, Tape & Reel Equipment Pick & Place, Rotary Test Handlers, MEMS Testing Laser Marking, CO2, YAG, 2D/3D Integration & Labeling Particle Interconnect (PI) Contacts &
Electronics Forum | Wed May 20 14:40:02 EDT 2015 | superlen
I have a question for SamSung users. We have a CP45 Neo and it seems that when we exit the program at the end of the day it blows away our last saved .opt file. Has anyone seen this? Here is a description of what I think is happening. 1. 8AM - We
Industry News | 2012-08-02 11:47:58.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.
Industry News | 2013-11-26 14:46:08.0
The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.
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Parts & Supplies | Pick and Place/Feeders
SMT Parts Siemens 720 920 Nozzle 0032597-10 Min. Order / Reference FOB Price 1 Piece US $10-20/ Piece Port: Shenzhen, China Production Capacity: 100PCS/Month Payment Terms: T/T, Western Union, Paypal Condition: New Basic Info Model NO.: 003
Technical Library | 2010-06-23 21:59:03.0
Quality control is one of the main bottlenecks in the production of micro-opto-electromechanical systems/microelectromechanical systems (MOEMS/MEMS) because each structure on a wafer is serially inspected and scanned stepwise over the entire wafer area.
The Vortik VPm Progressive Cavity Pump dispensing two-component materials for encapsulation.
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Jan 20 00:00:00 EST 2021 - Fri Jan 22 00:00:00 EST 2021 | Tokyo, Japan
NEPCON JAPAN - Electronics R&D and Manufacturing Technology Expo
Wafer-Level Packaged MEMS Switch With TSV Wafer-Level Packaged MEMS Switch With TSV by: Nicolas Lietaer, Thor Bakke, Anand Summanwar; SINTEF , Per Dalsjø, Jakob Gakkestad; Norwegian Defence Research Establishment (FFI), Frank Niklaus; KTH - Royal
