Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
New Equipment | Fabrication Services
Hitechpcb is a professional manufacturer of copper based printed circuit board (PCB). We produce metal-based MCPCB, aluminum substrate and copper substrate PCBs. with short delivery time, strict quality and excellent service. What is Copper Based PCB
New Equipment | Fabrication Services
Aluminum PCB, or Aluminium PCB, also called Alu PCB, is one of Insulated Metal Substrate (IMS) PCBs, and is also one of the most commonly used Metal Core PCBs (MCPCB) nowadays. HitechPCB manufactures Aluminum printed circuit boards (PCB) with a full
Electronics Forum | Thu Nov 11 10:55:32 EST 1999 | KenF
Hi, could anyone tell me the maximum size of an SMD ceramic capacitor that can be assembled on a copper based substrate reliably? The SMD will be reflowed on the copper substrate. The main concern is the CTE mismatch between the ceramic capacitor and
Electronics Forum | Tue Jan 29 09:19:56 EST 2002 | bob_smith
Can someone tell me what metal substrates are comonly used for component leads with gold plating? If the gold plating is missing, are any of the substates incompatible with 63/37 solder? Thanks.
Used SMT Equipment | Semiconductor & Solar
Metal Substrate Laser Marking System
Used SMT Equipment | Semiconductor & Solar
Precision Straightner for Metal Substrates
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2018-04-22 19:12:45.0
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Technical Library | 2021-08-18 01:24:20.0
Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. New static and dynamic tests are being developed to evaluate the performance of these systems. Dynamic radius of curvature and torsional test results are presented for a flexible hybrid electronics system with a FleX Silicon-on-Polymer operational amplifier manufactured in an 180nm CMOS process with 4-levels of metal interconnect mounted on a PET substrate.
Technical Library | 2021-11-03 16:52:47.0
This paper proposes the integration of pulsed photonic sintering into multi-material additive manufacturing processes in order to produce multifunctional components that would be nearly impossible to produce any other way. Pulsed photonic curing uses high power Xenon flash lamps to thermally fuse printed nanomaterials such as conductive metal inks. To determine the feasibility of the proposed integration, three different polymer additive manufacturing materials were exposed to typical flash curing conditions using a Novacentrix Pulseforge 3300 system. FTIR analysis revealed virtually no change in the polymer substrates, thus indicating that the curing energy did not damage the polymer. Next, copper traces were printed on the same substrate, dried, and photonically cured to establish the feasibility of thermally fusing copper metal on the polymer additive manufacturing substrates. Although drying defects were observed, electrical resistivity values ranging from 0.081 to 0.103 Ω/sq. indicated that high temperature and easily oxidized metals can be successfully printed and cured on several commonly used polymer additive manufacturing materials. These results indicate that pulsed photonic curing holds tremendous promise as an enabling technology for next generation multimaterial additive manufacturing processes.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
MDS-620 cuts flexible and ultra-thin PCBs clean, with no ripping or tearing, the linear rather than circular, cutting surfaces allow for faster separations without added stress. To get more information from below link: http://www.1clicksmt.com/produ
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SMTnet Express, October 15, 2015, Subscribers: 23,684, Members: Companies: 14,684, Users: 39,145 Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Dave Sommervold, Chris Parker, Steve
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/metal-fabrication?con=t&page=29
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FKN Systek | http://fknsystek.com/K3000.htm
. These can be used to singulate standard FR4 PCBs and aluminum substrate panels used in the lighting industry. The K3000L can be used to singulate metal substrate panels up to 24" long . Specifications
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