New Equipment | Cable & Wire Harness Equipment
Overview Microscope for visual analysis of cross-sectional images of crimped connections. Precise results in real-time Simple connection and installation with standard PC Clear illumination with LED ring light Analysis according to
New Equipment | Cable & Wire Harness Equipment
Overview The SawInspect System 6 (SIS 6) is an innovative new product that provides crimp quality assurance and quality control to the wire processing industry. This extremely compact sawing and inspection system is used to quickly create and analyz
Electronics Forum | Fri May 30 07:45:06 EDT 2014 | rrosera
Can anyone recommend a good reasonably priced microscope for looking at cross sections? The ones I'm finding with the magnification we're looking for all seem to be for glass slides.
Electronics Forum | Mon Jun 02 22:28:29 EDT 2014 | acdc
Try the VPI-1000 by Easy Braid. Solid choice with great customer feedback.
Industry News | 2022-11-21 15:56:18.0
Deadline for proposals: December 5, 2022
Industry News | 2020-11-24 15:24:33.0
Deadline for abstracts and proposals: January 5, 2021
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2021-09-21 20:36:45.0
The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform- Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques.
Events Calendar | Tue Mar 12 00:00:00 EDT 2019 - Thu Mar 14 00:00:00 EDT 2019 | Munich, Germany
LOPEC 2019 - 11th International Exhibition for the Printed Electronics Industry
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, September 23, 2021, Subscribers: 26,674, Companies: 11,444, Users: 26,860 Micro-Sectioning of PCBs for Failure Analysis Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize
