Industry Directory: mid-chip solder balling (33)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

Max Top Company

Industry Directory |

Solder Wire, Solder Bar, Solder Paste, Solder Ball

__FOOTER__

New SMT Equipment: mid-chip solder balling (127)

BGA Reballing Service

BGA Reballing Service

New Equipment | Rework & Repair Services

BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

BGA Reballing Training

New Equipment | Education/Training

In this One-Day class you will learn successful techniques to re-ball BGA Components.  Both Lead and Lead Free Solder Balls will be covered.  The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the

Precision PCB Services, Inc

__FOOTER__

Electronics Forum: mid-chip solder balling (2158)

Solder balling under passives

Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram

Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo

Solder balling under passives

Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch

Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC

__FOOTER__

Used SMT Equipment: mid-chip solder balling (15)

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

__FOOTER__

Industry News: mid-chip solder balling (501)

Pac Tech USA Offering Contract Wafer Bumping, Stencil Services

Industry News | 2003-01-27 10:27:31.0

At a New Facility Within the Company's U.S. Headquarters

SMTnet

__FOOTER__

Parts & Supplies: mid-chip solder balling (35)

Yamaha Automatic PCB Lead Cutter

Parts & Supplies | Other Equipment

Automtaic PCB Lead Cutter, Lead Cutting Machine   FEATHERS    The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t

Qinyi Electronics Co.,Ltd

Yamaha Automatic PCB Lead Cutter

Yamaha Automatic PCB Lead Cutter

Parts & Supplies | Other Equipment

Automtaic PCB Lead Cutter, Lead Cutting Machine   FEATHERS    The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t

Qinyi Electronics Co.,Ltd

__FOOTER__

Technical Library: mid-chip solder balling (44)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Surface Insulation Resistance (SIR) Testing

Technical Library | 2007-02-01 09:36:26.0

Purpose: Compare the Surface Insulation Resistance of reworked BGA Test samples made with standard solder balls using a flux only reattachment and samples made including the StencilQuik™ product from Best Inc. with solder balls using a flux only reattachment.

BEST Inc.

__FOOTER__

Videos: mid-chip solder balling (88)

Shuttle Star BGA Rework Station Features Side View Camera

Shuttle Star BGA Rework Station Features Side View Camera

Videos

BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.

Precision PCB Services, Inc

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Videos

Amid the COVID 19 crisis, Precision PCB Sevices, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern Californa and Dallas, Texas. Today are introducing our new Side View Camera for BGA Rework

Precision PCB Services, Inc

__FOOTER__

Training Courses: mid-chip solder balling (13)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

__FOOTER__

Events Calendar: mid-chip solder balling (8)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Ball Grid Array Rework - How to Do It Successfully

Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,

Ball Grid Array Rework - How to Do It Successfully

Surface Mount Technology Association (SMTA)

__FOOTER__

Career Center - Jobs: mid-chip solder balling (11)

Mid-Atlantic Regional Sales Manager

Career Center | Philadelphia, New Jersey USA | Sales/Marketing

LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e

Electronics Search Group of MRI

WAVE SOLDER

Career Center | Oakville, Ontario Canada | Production

Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety o

XLTEK

__FOOTER__

Career Center - Resumes: mid-chip solder balling (9)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

__FOOTER__

Express Newsletter: mid-chip solder balling (981)

SMTnet Express - December 7, 2016

SMTnet Express, December 7, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland

__FOOTER__

mid-chip solder balling searches for Companies, Equipment, Machines, Suppliers & Information