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PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
A minority owned business with 40 plus years of experience that can fit your needs, in electrical engineering, printed circuit board, and mechanical design. With Alta Design Corp, we want to be an extension of your company. We understand the meaning of �Time to Market� and will ensure we meet your due date, while being price competitive.
We are well versed in the following thermal application materials: Sil-Pad thermally conductive insulators Gap-Pad thermally conductive gap filling material Q-Pad thermal grease replacement film Bond-Ply thermally conductive adh
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Electronics Forum | Fri Nov 27 00:36:02 EST 2015 | slouis2014
I just encountered a BGA design were in, underneath the BGA is a silkscreen that covered the entire bottom of the component except for the copper pads. Can you give any information and advice for this type of design.
Electronics Forum | Fri Dec 20 09:01:27 EST 2002 | russ
Greetings, Does anybody out there have any experience with 0306 capacitors (not 0603). I am trying to find a pad design for this component. I have searched the archives to no avail. The component is .06 long by .03 wide with .007" solder terminat
Used SMT Equipment | In-Circuit Testers
Description Make: Takaya Model: APT-9411CE Year: 2010 Type: Flying Probe Details: Takaya APT 9411 CE Flying Probe The APT-9411CE is designed for users who are looking for a precise and reliable test system with an easy to use softwar
Used SMT Equipment | Board Cleaners
Speedline Technologies AquaJet Stencil Batch Cleaner and Resys ClosedLoop System For Sale The wash needs a control board. (Part Description: BL1700 CNTRL 16IN 16OUT) The Part Number to Purchase this board is 20-101-0214. Estimated cost is $349. We h
Industry News | 2003-06-17 08:07:40.0
The Radiall SMT coupler range now includes the new 14.2 x 5.1mm mini type.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Parts & Supplies | Pick and Place/Feeders
PANASONIC NOZZLE No.235CSN Mark Bar Code N610119485AB 100% original new product that guarantees high quality and precision for SMT machines. With fast response and fast delivery, this nozzle provides excellent technical support to ensure optimal pe
Parts & Supplies | Pick and Place/Feeders
PANASONIC NOZZLE No.226CS N610040787AB The PANASONIC NOZZLE No.226CS N610040787AB is a 100% original new product, ensuring the highest level of quality and compatibility with PANASONIC SMT machines. With its excellent technical support, this nozz
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
www.unisoft-cim.com/pcbtest.htm - In minutes the Unisoft ProntoTEST-FIXTURE software translates CAD & BOM files into real reference designators, netlists, X/Y component pin geometries, values, tolerances, part numbers, etc. This data is used by Test
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | Lincoln, Nebraska USA | Engineering
Brief Description of Job Duties: Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and r
Career Center | Newport Beach, California USA | Engineering,Management,Production
KEVIN RAGER P.O.BOX 7878, NEWPORT BEACH, 949 922 8997, KEVIN.RAGER@EDA-INC.US OBJECTIVE I am trying to find a consistent work flow that provides mentally challenging yet stimulating experiences in design and prototype development. EXPERIENCE 1997
SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic
KingFei SMT Tech | http://www.smtspare-parts.com/sale-8536384-nxt-h08-h12-pick-n-place-machine-nozzle-assembly-1-8m-melf-nozzles-aa19g00.html
1.8m MELF AA18C00 Nozzle 3.7G with rubber pad AA06300 Nozzle 5.0G with rubber pad Brand Part Name Model Condition Description FUJI Nozzle AA19G00 Original New with stocks Usage For NXT H08/H12
Imagineering, Inc. | https://www.pcbnet.com/blog/making-the-most-of-smaller-components-with-hdi-pcbs/
. As HDI design is becoming predominant and component pitch is becoming finer, PCB designers are opting for via-in-pad plated over, also known as VIPPO or POFV, structure
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