Industry Directory | Manufacturer
Bestar Steel Co., Ltd., as one of the professional steel pipe manufacturer in China, is a dedicated carbon steel pipe provider and exporter for high performance price ratio seamless steel pipes and welded steel pipes.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Spectra-Tech is a contract manufacturing company located in Cincinnati, providing exceptional service, quality and value. Our core services are printed circuit board (PCB) assembly box-build and assembled cables.
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Panasonic SMT FEEDER CM402 CM402 / CM602 ·8mm KXFW1KS5A00 with sensor KXFW1KSBA00 without sensor ·12/16mm KXFW1KS6A00 with sensor KXFW1KSCA00 without sensor ·24/32mm KXFW1KS7A00 with sensor KXFW1KSDA00 without sensor ·44/56mm KXFW1KS8A00 with sensor
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
Electronics Forum | Tue Jan 03 05:08:50 EST 2006 | Rob
Yes - as they flex less due to their size. I do have the calculations somewhere from my field apps days but it may take some time to find. The problems occuring with the X7R's MU
Electronics Forum | Wed Feb 10 17:00:44 EST 1999 | James Seagle
Does anyone have experience placing a Pinrex 2mm 2x20 SMT header. The dimensions of the part are as follows: length 40mm (1.58"), width 6mm (.236"), height 5.35mm (.211"), pitch 2mm (.079"). If so, what type of centering are you using? Any advice
Used SMT Equipment | Pick and Place/Feeders
(Qty) Feeder Type (40) 8 mm (5) 12 mm (2) 16 mm (2) 24 mm (1) 44 mm (1) Vibratory Feeder (1) Belt Feeder 5 belts (1) Waffle Tray
Used SMT Equipment | Pick and Place/Feeders
The machine includes the following: 3 Banks of 10 lines for 8mm 2 Bank of 4 lines for 8 mm 1- 12 mm 1 – 16 mm 1- 24 mm 1 Bank of 7 lines for 12 mm This gives a total of 38- 8mm, 9 – 12mm, 2 – 16mm and 2 – 24mm Also has a Tube feeder and a Tra
Industry News | 2003-05-19 08:44:19.0
Two new PCB power connectors offer easy high power wiring (up to 54A) with built-in safety features to prevent incorrect connections and resist strong vibration.
Industry News | 2003-05-16 08:23:59.0
A novel PCB socket block features integrated crossconnections, which facilitate daisychaining of supply voltage and signal lines in multiboard applications, saving installation time and money.
Parts & Supplies | Pick and Place/Feeders
SM 8x4MM 2 FEEDER WEIGHT:8MM 2.7KG
Parts & Supplies | Pick and Place/Feeders
SM 8x4MM 2 FEEDER WEIGHT:8MM 2.7KG jenny@ksunsmt.com
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Technical Library | 2010-06-24 21:20:05.0
Cost-effective assembly of custom-designed microelectromechanical systems (MEMS) for medium-caliber fuzes is challenging. In particular, the environment must have a setback acceleration exceeding 60,000g and centripetal acceleration of 9000g/mm out of center in a 30mm#2;173 projectile. In addition, the space available is very limited. The traditional approach is to mount the MEMS chip in a package that is then soldered to the printed circuit board (PCB). However, by mounting the MEMS chip directly to the PCB using conductive adhesive, we can increase the packaging density while reducing manufacturing cost.
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
ORION Industries | http://orionindustries.com/pdfs/mylarel21.pdf
. Typical Values for Major Properties Tensile Dimensional Nominal Strength Stability Dielectric Thickness, MD/TD,* Elongation MD/TD,* Density, Strength (AC), µm (Gauge) kg/mm2 (kpsi) MD/TD,* % % Shrinkage Opacity
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/imaps-technical-presentation-and-lunch
. This underfill process is being used in production for chip-on-wafer and chip-on-BGA packaging. In one example, underfill must be dispensed within 300-500um KOZ of 2-5 mm2 size die at 4000 UPH
