Industry Directory | Consultant / Service Provider
World's leading EDA company.
Industry Directory | Distributor
HKFEILDI IS A PROFESSIONAL SUPPORT IC AND MODULE COMPANY, THAT CAN HANDLE A WIDE RANGE OF BUSINESSES INCLUDING ASIC AND VARIOUS IC COMPONENTS.
New Equipment | Rework & Repair Equipment
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Optical aligment bga rework station WDS-700 automatic mobile phone repair machine for galaxy note 4 emmc
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Hottest professional mobile phone repair machine WDS-700 auto bga chipset rework station with free training
Electronics Forum | Mon Jun 06 07:14:21 EDT 2005 | pci
We find it impossible to remove the glued chips > like the CPU and the UEm ICs in Nokia Mobile > Phones. They are both surface mount devices and > glued with some chemicals we think. Any help is > most needed in this matter. May we know what pr
Electronics Forum | Sun Jun 05 13:42:16 EDT 2005 | amigo
We find it impossible to remove the glued micro-BGA chips like the CPU and the UEM ICs used in Mobile Phones. They are both surface mount devices and glued with some chemicals we think. Any help is most needed in this matter.
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Industry News | 2015-10-29 12:52:22.0
Whizz Systems Inc., in partnership with Cypress Semiconductor and Place Global, is proud to unveil Helio, the world's first solar powered beacon.
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Parts & Supplies | Assembly Accessories
Samsung original inventory accessories: 1. Samsung CP45:8 * 4 MM 12 MM 16 MM 24 MM 32 MM 44 MM 56 MM Feida 2. Samsung SM321/421 8 * 4 MM 12 MM 16 MM 24 MM 32 MM Feida 3. Samsung CP45 Sucker: TN140 TN 220 TN065 TN400 TN750 4. Samsung CP45FVNEO/SM3
Parts & Supplies | Assembly Accessories
Samsung original inventory accessories: 1. Samsung's original new SM/CP vibrate to spot 2. Samsung's original new SM 8mm * 2 8mm * 4 12mm 16mm 24mm 32mm 44mm FEEDER spot 3. Samsung original brand new CP45 sucker: TN140 TN220 TN065 TN400 TN
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Events Calendar | Wed Jan 20 00:00:00 EST 2021 - Fri Jan 22 00:00:00 EST 2021 | Tokyo, Japan
NEPCON JAPAN - Electronics R&D and Manufacturing Technology Expo
Career Center | San Jose, California USA | Engineering
www.srqconsultants.com : for all Job Reqs This Analog IC Test Development Engineer position will require senior level ability on at least one of the following machines: Teradyne: Catalyst, A5XX, J750, Tiger Agilent 84000, 94000 Credence Duo, Quarte
Career Center | , California USA | Engineering
www.srqconsultants.com : for all Job Reqs This Lead Analog IC Test Development Engineer position will require senior level ability on at least one of the following machines: Teradyne: Catalyst, A5XX, J750, Tiger Agilent 84000, 94000 Credence Duo, Q
Career Center | Cavite, Philippines | Engineering,Technical Support
I had 15 years Handling SMT Equipment.
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
KingFei SMT Tech | https://www.smtspare-parts.com/sale-14256003-samsung-sm320-single-ic-tray-double-side-sm-ic-tray-l565-w350mm.html
Samsung SM320 Single IC Tray Double Side SM IC Tray L565*W350mm Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://www.feedersupplier.com/sale-14497431-samsung-hanwha-ic-tray-feeder-smt-samsung-machine-spare-part.html
Samsung Hanwha Ic Tray Feeder Smt Samsung Machine Spare Part Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
