Industry Directory | Consultant / Service Provider
Premier web and mobile application Development Company based in ahmedabad, India. With over 10 years of experience we have been delivering solutions that exceed our client’s expectation. We have staff including well educated,..
Industry Directory | Manufacturer
With over many years of PCB assembly experience, we can produce high-density PCBA such as a main-controlled board for electronics equipment, I/O Board for Robots, and PCBA for Smart Homes. ODM or OEM business are available.
Antennas exist in all communication equipment and in a broad range of electronics. The industries that use antennas range from telecom to medical industry to military applications. Current antennas are much smaller than previous generations and, in m
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz ESL3 9kHz To 3GHz EMI Test Receiver The R&S ESL EMI test receiver combines two instruments in one, measuring EMC disturbances in accordance with the latest standards and also serving as a full-featured spectrum analyzer for dive
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Industry News | 2012-08-23 16:08:55.0
The SMTA is pleased to announce the launch of a new mobile application for the SMTA International Conference and Exhibition using Guidebook.
Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
Technical Library | 2018-08-22 14:05:42.0
Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2. This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances.
Career Center | , Pennsylvania USA | Engineering,Production,Quality Control,Research and Development
SKILLS Quote preparation for RFQ projects. Exposure to IPC A 610 and IPC A 600. Knowledge of Potential Failure Mode Effect Analysis (PFMEA), Process control plan (PCP) for new products, based on the Critical to Quality (CTQs). Knowledge in handli
SMTnet Express, August 23, 2018, Subscribers: 31,271, Companies: 11,024, Users: 25,118 Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications Bhupender Singh, Gary Menezes, Scott
Heller Industries Inc. | https://hellerindustries.com/europe/
(Sat Nav B98 9HN), United Kingdom. Tel: +44 (0) 1386 791074 E-mail: Sales inquiry E-mail: Service and Applications Sales Director : Matt Jones Mobile: +44 (0
GPD Global | https://www.gpd-global.com/co_website/contact-salesteams-northamerica.php
Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam
