Industry Directory | Manufacturer
We make a variety of Metal Stampings specializing in Connectors, Switches, Terminals, Heat sinks, RFI/EMI shielding, Lead frames, Battery contacts and Spring contacts.
Single-Stroke Pneumatic Operation with Easily Interchangeable Dies Die changes in under 1 minute Steel base for extremely long life Large variety of dies available Slash labor costs over hand tool use Precision dies to protect components dur
New Equipment | Board Handling - Storage
A vacuum wand is a tool for gripping and holding a delicate miniature object securely without touching it with your hand. (cannot inhale like a vacuum cleaner!!) This means the object is not damaged. A vacuum pump connected to the wand body provides
Electronics Forum | Mon Jan 04 16:55:47 EST 2010 | dyoungquist
We use a HEPCO model 3000-2 (hepcoblue.com) to shorten leads on various through hole components before we solder them on a pcb. You will have to verify they have a die that works with your particular LED module. If they do, this is what I would rec
Electronics Forum | Mon Mar 24 12:15:24 EST 2003 | zaxx007
Hi Kevin, Hepco makes a small unit called a Hepco 3000-2, with the right die set this should be no problem. The unit should retail for around $600.00USD, have a good day. Sincerely, Zack Schmad factory-automation@cox.net
Used SMT Equipment | General Purpose Equipment
ASM MS899-DL Wafer Mapping Die Sorter Machine is in like new condition! Serial Number: MS899DL-01817-0402 Model Number: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surfa
Used SMT Equipment | X-Ray Inspection
Very Nice Nicolet Xray Machine For Sale The system is complete and in good working condition See attached pictures and information below Nicolet Imaging Systems Model Number: NXR-1500 Serial Number: 0150011 Year 2000 Variable Speed Joystick
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2014-06-03 13:04:15.0
The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.
Parts & Supplies | AOI / Automated Optical Inspection
Panasert avk parts 1020312039 1020312040 Ordinal number Applied model Parts Name Parts No. 1 JV SHAFT 0551038 2 JV PUSHER(L) 0552002 3 JV SLIDER(L) 0552003 4 JV PUSHER(R) 0552008 5 JV SLIDER(R) 0552009 6 JV CUTTER 0552020 7 JV CUTTER 0552020
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Parts & Supplies | Assembly Accessories
Main Features 1, Simple structure in linear type ,easy in installation and maintation. 2, Adopting advanced world famous brand components in pneumatic parts ,electric parts and operation parts. 3, High pressure double crank to control the di
Technical Library | 1999-05-07 10:14:57.0
This paper describes a model developed to calculate number of redundant good die per wafer. A block redundancy scheme is used here, where the entire defective memory subarray is replaced by a redundant element. A formula is derived to calculate the amount of improvement expected after redundancy. This improvement is given in terms of the ratio of the overall good die per wafer to the original good die per wafer after considering some key factors.
Technical Library | 2023-11-27 18:29:45.0
This paper examines the modeling of viscoplastic solder behavior in the vicinity of interfacial cracking for flip chip semiconductor packages. Of particular interest is the relationship between viscoplastic deformation in the solder bumps and any possible interface cracking between the epoxy underfill layer and the silicon die. A 3-D finite element code, developed specifically for the study of interfacial fracture problems, was modified to study how viscoplastic solder material properties would affect fracture parameters such as strain energy release rate and phase angle for nearby interfacial cracks. Simplified two-layer periodic symmetry models were developed to investigate these interactions. Comparison of flip chip results using different solder material models showed that viscoplastic models yielded lower stress and fracture parameters than time independent elastic-plastic simulations. It was also found that adding second level attachment greatly increases the magnitude of the solder strain and fracture parameters. As expected, the viscoplastic and temperature dependent elastic-plastic results exhibited greater similarity to each other than results based solely on linear elastic properties. !DOI: 10.1115/1.1649242"
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http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/138.html ??????????? ???????? ????/?????? ???????? ???? ??????/??????????? ????/PCB Punch depanel machines
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Altoona, Pennsylvania USA | Sales/Marketing
MacDermid Alpha Electronics Solutions, a Element Solutions, Inc. business and world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is s
Career Center | Cavite, Philippines | Engineering,Technical Support
I had 15 years Handling SMT Equipment.
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems SMTnet Express April 6, 2012, Subscribers: 25060, Members: Companies: 8851, Users: 32937 Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems by: L
| https://www.wesource.com/miscellaneous/molex-638017200-tm-3000-universal-crimp-press-with-two-dies-id-54126/
638017200 TM-3000 Universal Crimp Press with Two Dies ID_54126 Molex 638017200 TM-3000 Universal Crimp Press with Two Dies ID_54126 Click to enlarge Price: $4,500.00 Model Number
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Die-Catalog-800-000.pdf
. Component Forming Dies CF-8 61 1 H oll ing sw ort h S tre et Gr an d J un cti on , CO 81 50 5 Tel : (9 70 ) 2 45 -04 08 F ax : (9 70 ) 2 45 -96 74 We b: ww w.g pd -gl ob al.c om GPD Part No. 800-000 # = requires purchase of secondary exit chute package
