Electronics Forum | Thu Nov 20 06:09:00 EST 2014 | jlawson
Anyone have any idea how to use the HLC software > and in particular the Production Planning side > whereby you can cluster a number of sides or > Jobs? I want to fix side 1 of a program and > optimise side 2 around side 1 fixing common parts >
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Industry News | 2010-06-11 15:59:00.0
BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.
Industry News | 2006-06-23 16:19:47.0
Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
