Industry Directory | Consultant / Service Provider / Manufacturer / Other / Training Provider
Koh Young is the leading True3D™ measurement-based inspection solutions provider supported by its global offices to ensure close communication with a growing customer base to provide access to AI-powered process optimization tools
ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide. Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref
Technical Innovation The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition) 4 times higher height measurement resolution than the existing Moire technology (The best
Electronics Forum | Wed Nov 28 08:42:19 EST 2001 | davef
Contact Cemal Basaran at the University at Buffalo Electronic Packaging Laboratory http://www.packaging.buffalo.edu. They develop Laser inspection technologies and use Moire Interferometry that may be able to do the things you want to do.
Electronics Forum | Fri Aug 30 11:20:17 EDT 2013 | jth
Hi, contact me at joe@zntechnologies.com. ZN Technologies offers warpage measurement at room temp and during reflow using the superior projection moire technique. Best regards, Joe
Used SMT Equipment | AOI / Automated Optical Inspection
Non-blind spot digital 8 projection moiré 3D inspection technology Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting Smallest componentinspection by ultra-high resolution camer
Used SMT Equipment | AOI / Automated Optical Inspection
Make: Mirtec Model: MV-7 OMNI Year: 2020 Type: 3D AOI Specifications: Fully Functional LIKE NEW - Mirtec Reconditioned June 2024 Exclusive 15MP/25MP CoaXPress Camera System OMNI-VISI
Industry News | 2020-06-30 15:07:32.0
MIRTEC is excited to announce its participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be broadcast live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST and will include a full program of live presentations, interviews and special guests.
Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Technical Library | 2013-01-31 18:43:15.0
There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices, the emergence of lead-free processing, and changes in device form factors. Warpage measurement has become a key measurement for analysis; prevention and prediction of interconnect defects and has been employed in failure analysis labs and production sites worldwide. First published in the 2012 IPC APEX EXPO technical conference proceedings
► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
