New Equipment | Surface Finish
The Minilock-Phantom is the first RIE system in the industry to incorporate a vacuum load-lock on a compact platform. The system has been designed to meet all the safety and equipment needs for the most challenging processes including etch applicatio
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
Electronics Forum | Fri Sep 23 06:42:08 EDT 2005 | lloyd
The only issues I have had in the past with the shuttle are 1. The transport conveyor into the machine was not aligned correctly causing pickup issue from the belt. 2. Operators not correctly loading parts in trays or updating the qty's, this meant
Electronics Forum | Wed Apr 05 08:51:25 EDT 2000 | Wolfgang Busko
Emmanuel: Popcorn effect is mostly caused by entrapped moisture in the components package material. Plastic ICs are known for absorbing and storing moisture when exposed to normal factory conditions. They should be stored in an moisture reduced envir
Industry News | 2003-04-21 10:24:56.0
Learning today for tomorrow's demands
Industry News | 2003-05-30 07:52:35.0
New courses on today's most important topics in electronics manufacturing, assembly, and related business issues
Technical Library | 2020-12-16 18:38:49.0
Fabrication of large structures using out-of-autoclave prepreg materials will lead to a great amount of savings in manufacturing costs. In the out-of-autoclave processing method, the presence of voids inside the laminate has been an issue due to the lack of high pressure during manufacturing. This study aims primarily to observe the moisture absorption response of composite samples containing different levels of void. By changing the vacuum level inside the bag during the manufacturing process, three different unidirectional laminates at three levels of void have been manufactured. After immersing the samples in warm water at 60°C for about one year, the moisture absorption level was monitored and then diffusion coefficients were calculated using Fick's law. Results show that the moisture absorption coefficient changes by %8 within the experimental range of void contents. The mechanical behaviour of these laminates has been studied at four different moisture levels by performing dynamic mechanical analysis (DMA) and short beam shear tests. Empirical results indicate that, in general, interlaminar shear strength and glass transition temperature decrease by moisture build-up inside the samples. DiBenedetto equation is proposed to make a correlation between the moisture content and glass transition temperature.
Technical Library | 2012-12-14 14:25:37.0
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products, smaller packaging, and longer battery life. By shrinking the size of the features they etch into semiconductor dice, IC manufacturers achieve lower costs, while improving speed and building in more functionality. However, this move toward smaller features has lead to lower breakdown voltages and increased opportunities for component overstress and false failures during in-circuit test.
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 99, (#ts#)) SMT Express, Volume 4, Issue No. 2 - from SMTnet.com Volume 4, Issue No. 4 Thursday, April 18, 2002 Featured
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 48, (#ts#)) SMT Express, Volume 3, Issue No. 3 - from SMTnet.com Volume 3, Issue No. 3 Thursday, March 15, 2001 Featured
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/txs02612rtwr-footprint-issues_topic2244_post9285.html
: 71 Post Options Post Reply Quote toshas Report Post Thanks(0) Quote Reply Topic: TXS02612RTWR Footprint Issues Posted: 30 Oct 2017 at 10:45am Hi! I downloaded TXS02612RTWR footprint and have some issues with it
| https://www.eptac.com/soldertips/issues-of-burnt-flux-on-class-3-pcb-assemblies/
) to pierce through the rosin, creating lots of open connections. Burnt flux implies the carbonization of the rosin material or any other material and this material is very susceptible to the absorption of moisture and the issues we just mentioned
