Industry Directory | Consultant / Service Provider / Manufacturer
Numerical Innovations develops software tools for PCB, MEMs, IC, Microwave/RF, and optical components - with tools like DFM Now! and FAB3000 that are revolutionizing the way in the PCB Industry.
Industry Directory | Manufacturer
Professionally provide RTP, PLasma Asher,Descum,Etcher, Sputter deposition, Metal thin film thickness measurement equipment made in U.S.A.
Easily Convert between: DXF, GDSII, Gerber, STL, 3D, ODB++, High Resolution TIFF/BITMAP, and more... To put it simply, ACE 3000 provides seamless 'two-way' translation between your electronic designs (for PCB, IC, MEMs, RF/Microwave, Chemical Millin
Benchtop model with the finest assembly precision for low to medium volume assembly production. LE40 benchtop model of pick and place machines offers technologically advanced, low cost solutions for low to medium volume SMT placement applications.
Electronics Forum | Sat Jul 16 18:40:12 EDT 2016 | aemery
As an MPM guy and would choose.....MPM, surprise! Of the legacy models the UP2000 seems to be the favor among most of my clients. Newer models like the Accuflex's and Accela/Momentims are great, but as far as the old stuff the UP2K's are the favorit
Electronics Forum | Wed Dec 10 13:03:15 EST 2003 | alden
The UP3000 is the generic name for the model series. The UP3050 has the following options as standard features on the machine: Vacuum Stencil Wiper Paste Dispenser Auto Pin Placement Auto Stencil Change 2D Inspection 3D Inspection
Used SMT Equipment | Screen Printers
MPM UltraPrint 3000 Vintage: 2001 Features: Auto Pin Support Under Stencil Wipe Auto Stencil Load New RheoPump Upward & Downward Fiducial Cameras Includes Comprehensive Spares Kit
Used SMT Equipment | Screen Printers
Speedline MPM Momentum HiE Screen Printer Model: Momentum HiE Year: 2011 Auto Tooling 2D Inspection Vacuum Under Wipe Power: 200-240V Complete & Operational
Industry News | 2022-11-21 15:50:26.0
ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB 'peels' away from the solder which minimizes the opportunity for bridging defects to occur.
Industry News | 2013-08-07 10:33:35.0
2) to maximize yields and product quality. In fact, the Momentum Compact delivers the highest throughput for its footprint in the industry.
Parts & Supplies | Other Equipment
SMT Printer Squeegee MPM 125 MPM 125 Printer Squeegee 1.for MPM screen printer, 2.stainless steel blade 3.Size 219/254/300/304/355/400/450/508 4.Accurate durable 5.Abnormal is ok In order to enhance the control of the pre-placement prin
Parts & Supplies | Pick and Place/Feeders
Our business circle: * Supply original new and used SMT spare parts. * Supply Copy new SMT spare parts. * Supply SMT relate equipment. * Supply SMT ancillary products and tools. * Repair Service. Look for any SMT parts, please just contact yok
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Career Center | Kitchener, Ontario Canada | Engineering,Maintenance,Technical Support
Knowledgeable in Design of Experiments (DOE), Design for Manufacturability (DFM), Statistical Process Control (SPC), Failure Mode & Effects Analysis (FMEA) and Root Cause Analysis that drives continuous improvement in package reliability. A recogniz
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