Electronics Forum | Tue Dec 21 17:56:13 EST 2010 | stepheniii
Am I reading your post correctly? You will print PCBs and not populate them until up to 24 hours later? And you can assemble level 3 components at 30C and 90% humidity, you just have to pro-rate the exposure time. (I don't recommend having those con
Electronics Forum | Wed Dec 08 09:53:23 EST 2010 | fönsi
Hello Because of the cold weather, we had some troubles with drying out of printed solder paste on the pcb's. The relative humidity in the air declined below of 20%. We have a process window of store the printed board for maximum 24 hours, but with
Industry News | 2024-04-03 07:15:13.0
IPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
SMTnet Express June 20, 2013, Subscribers: 26136, Members: Companies: 13402, Users: 34820 Implementation of Effective ESD Robust Designs by: Industry Council on ESD Target Levels While IC level ESD design and the necessary protection levels
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