Industry Directory | Manufacturer
As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.
Industry Directory | Consultant / Service Provider / Manufacturer
From the Irvine, CA office Nanovea began designing and manufacturing instruments after years of experience in providing solutions for profilometry, mechanical and tribology applications.
New Equipment | Test Equipment
The CSM Instruments Table Top Instrument places the performance of the standard Nanoindentation Tester (NHT) into a small and simple-to-use instrument which is ideally suited to routine nanoindentation testing where a full platform configuration may
New Equipment | Test Equipment
THE NEW GENERATION OF NANOINDENTER CSM Instruments has introduced a new nano range high resolution nanoindenter with ultra low thermal drift. When used per ISO 14577 test methods the Ultra Nano Hardness Tester will provide the most accurate data of
Electronics Forum | Tue Mar 02 21:05:38 EST 2004 | Ken
Has anyone in the US used this system? I am told that over 1000 systems are operating world wide...but find it hard to believe no one domestically is using this (if it in fact is worth its salt would more not use it?) Anyone? Anyone demo'd this? A
Electronics Forum | Thu Apr 09 22:50:50 EDT 1998 | Larry
Configuration of our HP 3065 in-circuit tester: HP3065 HL testhead with CL+ controller with 2 hard drives and tape drive 11 Hybrid cards 4 Analog cards 1 GP relay card 2 DUT power supplies (6038A) 1 HP color terminal (2397A) 2 HP terminals (700/92 an
Used SMT Equipment | In-Circuit Testers
Agilent 8593A-021 The 8593A is a compact, portable Microwave Spectrum Analyzer operating from 9 kHz to 22 GHz. Internal synthesis ensures frequency accuracy. An internal preselector eliminates the worry about identifying signals that exist. A com
Used SMT Equipment | In-Circuit Testers
Agilent 16903A Logic Analysis System The Agilent 16903A logic analysis system provides high-performance, system-level debugging of digital designs. Expandability is the key to the system´s long-term value. Customize this system for your specifi
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Parts & Supplies | Assembly Accessories
KIC START profiler,kic thermal profile,smt thermal profilling Image Reflow Profile 9 6 Channel Tester Accuracy: +/-1.2°C Resolution: 0.3 °C to 0.1 °C Internal operating temperature: 0 °C to 105 °C For thermocouples: 9/12 K Ty
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Parts & Supplies | Pick and Place/Feeders
Supply&repair juki spare parts at l lower price: JUKI 710(720) CARRY UNIT E86127150B0 JUKI 710(720) CPU CARD E8601715AA0 JUKI 730(740) CARRY BOARD E86067210A0 JUKI 730(740) DC SERVO DRIVER E86037210A0 JUKI 750(760) AC SERVO CARD E86027210A0
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
Commonly referred to "Cleanliness Testing" as this test method has, for over 40 years, been acknowledged as an important Quality Assurance and Process Control tool in the manufacture of electronic circuit boards, components and assemblies. The Conta
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | kerala, any ware India | Production
i have experience in • Operation of wave soldering and water cleaning machine • Inspection ( Reflow and Post Wave ) • Pre Reflow inspection in SMD • Component forming stuffi
