Electronics Forum | Tue Apr 09 00:09:25 EDT 2002 | craigj
Question. When profiling and looking at the profiles cooling rate. Over what temperature range should the slope be monitored and what sort of cooling rates should be looked for. Paste supplier says no more than 6degC per sec, some components maybe lo
Electronics Forum | Tue Apr 09 07:41:08 EDT 2002 | johnw
Craig, it depend's n what you want to look at. In term's of te gran structure of the solder jont that's formed when the joint is cooling so you'd want to monitor the temperature drop from the peak or say 215dg C for ref down to probably about 150 an
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] The SPVC investigation demonstrated that the number of cycles to failure did not correlate with void size. If there was a negative influence of voids the solder joint integrity, Figure 3 would show a cluster of early low cycle failures for larger voids and a cluster of late cycle failures for the small voids
