Tiger International(Shanghai)Co.lTD-RiZhao office is one of the largest buyer of non ferrous metal scrap and minerals, esp NiSn scrap,Sn scrap.
Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
New Equipment | Solder Materials
We offer Lead Free Solder Wire and Halogen Free Solder Wire; OEM service is available. Alloy / FLUX F4 F10 Sn/Cu v v Sn/Ag v v
New Equipment | Solder Materials
In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive features of SN100C
Electronics Forum | Mon Jun 14 17:21:31 EDT 2004 | russ
How old are these parts? Sn/Ni plating is very succeptable to age and everything else. They are possibly tarnished. Also, what is your peak temp in reflow? It takes about 225 230 C to get good wetting to the underlying nickel. Russ
Electronics Forum | Mon Jun 14 16:48:34 EDT 2004 | jsmith01
Is any one else having a problem with parts that are Ni/Sn plated? The parts in question are a 1206 voltage suppressor form AVX. I am still using a stander 63/37 solder paste which is according to AVX�s web sight compatible with this plating. The
Used SMT Equipment | Depanelizers / Routers
Asys ADS 03M Depanelling System with Ruwac Dust collector Model: ADS 03 M Year: 2011 S/N: 041199 - X- and Y-axis with high-end linear motors - Servo-driven Z-axis - Electrically-driven rotary table - Dual station - HMI offers comfortable ope
Industry News | 2019-01-30 08:13:02.0
The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Industry News | 2018-10-18 08:46:25.0
"Lead-Free" Semiconductor Industry
Parts & Supplies | Assembly Accessories
SMT MACHINE GENUINE Juki Spare Parts JUKI 2050 2060 2070 2080 RESISTOR ASM 3 OHM 40021645 JUKI Pats Specifications: Brand Name JUKI 2050 2060 2070 2080 RESISTOR ASM Part number 40021645 Model 3 OHM Ensure Test in machine confirmation Guar
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Product name: Solder Bar Product code: NAP100 Alloy composition: Sn/Cu0.7/Ni0.05 Packing: ≈700g/pcs, 20kg/box MOQ: 500KG Price: Contact us for best price Features: - Quality guarantee (R.O.C Patent No.1366495) - No recycle material - Less 20
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
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Hyland; Agilent Au over Ni on Cu is a widely used p
| https://pcbasupplies.com/alloy-solder-paste-enig/
. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
