supplier of clad & pure nickel powders and conductive fillers; additives used in the formulation of thermally & electrically conductive polymers, elastomers (emi gaskets and seals) & plastics with rf emi shielding properties.
Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
New Equipment | Fabrication Services
Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
We manufacture and distribute a complete line of resinoid,metal sintered, and nickel bond diamond dicing blades. Resinoid blades: used on Glass, Ceramic, Sapphire and Quartz. Nickel bond: used to cut Silicon and III-V materials. Metal Sintered stress
Electronics Forum | Thu Jul 15 11:17:03 EDT 2010 | davef
Things don't disappear completely. If something caused nickel corrosion, the nickel corrosion by-product would be in place of the nickel. Is it possible that ... There never was any nickel? We know that the nickel will diffuse into the copper. Th
Electronics Forum | Thu Jul 15 13:27:42 EDT 2010 | xps
Thanks... anyway I confirm, the nickel disappear (verified by cross section)and a strange substance greyish above gold, covering the tabs after test. I don't know the reason for this phenomenon. I don't believe that with proper electrolytic nickel fi
Used SMT Equipment | In-Circuit Testers
For more than a decade, communications service providers have relied on TTCs T-BERD family of test instruments. Now our development team has created a revolutionary new T-BERD that looks, feels, and performs like no other test instrument available to
Used SMT Equipment | In-Circuit Testers
JDSU T-Berd 2209 For more than a decade, communications service providers have relied on TTCs T-BERD family of test instruments. Now our development team has created a revolutionary new T-BERD that looks, feels, and performs like no other test in
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Parts & Supplies | SMT Equipment
PA Main Parts Part Name：NICKEL HYDRIC STORAGE BATTERY PART No：N9973GB6-005 Part Name：PIN PART No：1023810003 Part Name：VANE PART No：N45214022A Part Name：CAM FOLLOWER & LOCK-NUT PART No：N531CFH6RA Part Name：PIN PART No：102381000
Parts & Supplies | SMT Equipment
PA Main Parts Part Name：NICKEL HYDRIC STORAGE BATTERY (电池) PART No：N9973GB6-005 Part Name：PIN (MSH头部螺丝-长) PART No：1023810003 Part Name：VANE (真空泵碳片) PART No：N45214022A Part Name：CAM FOLLOWER & LOCK-NUT (支撑凸轮及螺母) PART No：N531CFH6RA Part Nam
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
This is video shows how to print a PCB using a prototype foil only stencil. The SMT prototype stencil (www.soldertools.net) is made from a high nickel content material able to offer repeatable high precision apertures. The steps of alignment, printin
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
SMTnet Express, November 6, 2014, Subscribers: 23500, Members: Companies: 14091, Users: 37109 Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Hugh Roberts, Sven Lamprecht, Gustavo Ramos, Christian Sebald
Heller Industries Inc. | https://hellerindustries.com/parts/589869/
589869 - Lead Screw, CLS, Nickel Plate Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文
