New Equipment | Rework & Repair Equipment
BEST circuit frames come in both dry film and epoxy versions. We can produce circuit frames in 1 and 2 oz copper as well as with shiny tin or nickle gold coating. These circuit frames are microetched on the board side in order to insure better adhesi
New Equipment | Assembly Services
Dependend aluminum plate 2312 SMT turnover of aluminum plate baking dish Purpose: COB SMT electronics factory turnover and baking Aluminum plate side added 14 air holes, so the vinyl easier baked in the oven, more energy conservati
Electronics Forum | Tue Mar 09 21:17:10 EST 2004 | gm05688
When soldering a metalized germanimum window to a nickle plated kovar part, I would like to understand the intermetalic. Does the nickle plate actually melt or will the solder(SN63)simple stick to the nickle and not cause nickle to reflow? Any one ou
Electronics Forum | Tue Mar 09 22:26:17 EST 2004 | davef
You should to be soldering to the nickel. The intermetallic is Ni3Sn4. "At relatively low temperatures, the tin-nickel layers form about as rapidly as the tin-copper layers do, but at higher temperatures their growth rate is distinctly lower. At 10
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Parts & Supplies | Pick and Place/Feeders
we have feeder storage cart in stock. Features and Benefits 2 Feeder shelves with anodized aluminum plates to locate and secure feeder to cart. Tooling designed per manufacturer’s specifications. Feeder Shelves are 35.5” long, positioned per fe
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Full Automatic V-cut PCB Depaneler Introduction: This equipment can further improve the quality of depaneling. It can realize V-groove XY two-way automatic cutting, cutting aluminum & FR4 boards without burr, can connect the assembly line to realize