Electronics Forum | Thu Feb 12 11:57:59 EST 2009 | jmiller
i have searched the forum for hours. read all the threads that deals with cleanliness and ionic testing. (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=40295) (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=22603) (http://www.
Electronics Forum | Thu Dec 03 15:30:00 EST 2015 | ttheis
We've started off with Kester 951 'no-clean' so far which is alcohol based I believe. It seems to do very well with foaming, activation and low residue, but if we can move to water based and get good results that would be great. The 951 flux and thin
Industry News | 2012-10-17 18:52:21.0
IPC — Association Connecting Electronics Industries® in partnership with Surface Mount Technology Association (SMTA) will host a High-Reliability Cleaning and Conformal Coating Conference, November 13–15, 2012, at the Crowne Plaza Hotel-O’Hare in Chicago.
Industry News | 2010-10-07 13:23:20.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 3 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Technical Library | 2013-04-11 15:43:17.0
With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in the field. One method of reinforcement has been the utilization of underfills to "glue" certain SMDs to the PCB. Bumped SMDs attached to the PCB with a no-clean soldering process offer the unavoidable scenario of the underfill coming in contact with a flux residue. This may or may not create a reliability issue... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
ALPHA® Preforms with solder paste adds solder volume.
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
SMTnet Express, November 5, 2020, Subscribers: 28,030, Companies: 11,176, Users: 26,227 Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? Credits: ZESTRON OEMs and CMs designing and building electronic
