Industry Directory | Association / Non-Profit
An independent body of ESD experts with the mission to review the ESD robustness requirements of modern IC products for allowing safe handling and mounting
New Equipment | Solder Paste Stencils
EasyBraid’s stencil rolls are designed for use in SMT screen printing lines which keep stencil apertures clear of paste residues during the automatic screen printing process. They also clean the bottom of stencils, keeping them free from paste and fl
SwissGrip� screwdrivers with their soft handle surface effortlessly transfer the rotational forces of the hand to the screw. They are particularly appreciated in all places where problem-free, non-tiring work is a requirement: in the high-tech sector
Electronics Forum | Mon Sep 13 22:32:41 EDT 2010 | genesan
Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the
Electronics Forum | Mon Sep 13 22:58:49 EDT 2010 | genesan
Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the
Used SMT Equipment | Circuit Board Assembly Products
The product introduction The SM-2009 scissors & pneumatic type separator, we use the most advanced non-stress idea to designed it, it’s help to prevent the chap phenomena as the PCB separated by the general separator, it’s improve the PCB’s quality
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Parts & Supplies | Pick and Place/Feeders
SMT Samsung CP feeder 32mm non-stop type NF for pick and place machine Samsung SM/CP40 CP45 Feeders models: SAMSUNG SM 8*2mm FEEDER SAMSUNG SM 8*4mm FEEDER SAMSUNG SM 12mm FEEDER SAMSUNG SM 16mm FEEDER SAMSUNG SM 24mm FEEDER SAMSUNG SM 32mm F
Parts & Supplies | Pick and Place/Feeders
SMT Samsung CP feeder 32mm non-stop type NF for pick and place machine Samsung SM/CP40 CP45 Feeders models: SAMSUNG SM 8*2mm FEEDER SAMSUNG SM 8*4mm FEEDER SAMSUNG SM 12mm FEEDER SAMSUNG SM 16mm FEEDER SAMSUNG SM 24mm FEEDER SAMSUNG SM 32mm F
Technical Library | 1999-05-07 10:38:11.0
This paper is a report of a study made to determine the maximum allowable impurities in solder used for wave soldering applications. This report concludes with a list of impurities compiled from actual analyses of solder which caused production problems. A list of recommended maximum allowable impurities will assist in establishing reliable quality controls on the purity level of the solder in a wave soldering machine.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | Javalera, Gen. Trias, Cavite Philippines | Engineering
Numonyx is a semiconductor company making flash memories, which was founded on March 31, 2008 by Intel Corporation, STMicroelectronics and Francisco Partners. The company supplies non-volatile memory for a variety of consumer and industrial devices i
Career Center | Williamsport, Pennsylvania USA | Engineering,Production,Quality Control
Spartronics develops, manufactures, and manages the full lifecycle of robust electronic and electromechanical devices for commercial aerospace, defense, space, instrumentation and control, life sciences and medical device applications. Our proven exp
Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support
- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.
Career Center | Bangalore, Indiana India | Production,Quality Control
Line audits 5’s line audits RoHS line audits Screen printing machine operating S.M.T M/c Operator “Siemens” HS-60, S-27, F5HM. S.M.T Fuji, cp6, ip3, xp143 & 243 M/c Technician. Awareness of reflow profiling and verification Servicing of mobile sets a
| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html
I.C.T-LV733 How to solve the problem of void, there will be use vacuum reflow soldering machine. Soldering in vacuum environment can fundamentally solve the oxidation of solder in non-vacuum environment, and due to the effect of internal and external pressure difference of solder joint, the
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
Component Contamination Board Contamination Pad Size Mismatch Cause Open Joint DEFECT Tombstoning Voids Solder Wicking Non-Wetting Incomplete Fillets Poor Strength Solder Shorts Solder Balls
